FEATURES

Low cost

Diffused junction

Low leakage

Low forward voltage drop

MECHANICAL DATA

Terminals: Axial lead ,solderable per

MIL- STD-750,Method 2026

Polarity: Color band denotes cathode

Weight: 0.014 ounces,0.39 grams

Mounting position: Any

Ratings at 25

ambient temperature unless otherwise specified.

Single phase,half wave,60 Hz,resistive or inductive load. For capacitive load,derate by 20%.

UNITS

Maximum recurrent peak reverse voltage

50

100

150

200

300

400

600

800

V

Maximum RMS voltage

35

70

105

140

210

280

420

560

V

Maximum DC blocking voltage

Maximum average forw ard rectified current

9.5mm lead length,

@T

Peak forw ard surge current

8.3ms single half-sine-w ave

superimposed on rated load

@T

Maximum instantaneous forw ard voltage

@ 2.0 A

V

Maximum reverse current

@T

at rated DC blocking voltage @T

Maximum reverse recovery

(Note1)

ns

Typical junction capacitance

(Note2)

pF

Operating junction temperature range

Storage temperature range

3.Thermal resistance f rom junction to ambient.

NOTE: 1. Measured with I

2. Measured at 1.0MHz and applied rev erse v oltage of 4.0V DC.

A

1.25

1.7

Typical thermal resistance

(Note3)

- 55 ---- + 150

0.95

EGP20A(Z) --- EGP20K(Z)

A

2.0

HIGH EFFICIENCY RECTIFIERS

VOLTAGE RANGE: 50 --- 800 V

CURRENT: 2.0 A

MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS

GALAXY ELECTRICAL

Case:JEDEC DO--15,molded plastic

EGP EGP EGP EGP EGP EGP EGP EGP

20A

20B

20C

20D

20F

20G

20J

20K

The plastic material carries U/L recognition 94V-0

DO - 15

High current capability

Easily cleaned with Alcohol,Isopropanol

and similar solvents

／Ｗ

40

Ａ

15

50

- 55 ---- + 125

70

45

75

5.0

100

www.galaxycn.com

BL

Document Number 1562109

1.

50

100

150

200

300

400

600

800

V

75

Typical thermal resistance

(Note 4)

4.Thermal resistance from junction to lead.

Dimensions in millimeters