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TMP93CU44DF Datasheet(PDF) 11 Page - Toshiba Semiconductor |
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TMP93CU44DF Datasheet(HTML) 11 Page - Toshiba Semiconductor |
11 / 48 page Quality and Reliability Assurance / Handling Precautions 030901 QUA-11 2002-02-20 Table 2.3 Storage conditions, permissible usage Period after unpacking and baking requirements for each soldering method (2/2) Products Name Package no. Air reflow Infrared reflow TMP95CW64F P-LQFP100-1414-0.50D A(168h) A(168h) TMP95CW65F P-LQFP100-1414-0.50D A(168h) A(168h) TMP95PW64F P-LQFP100-1414-0.50D A(168h) A(168h) TMP95FY64F P-QFP100-1414-0.50E A(168h) A(168h) TMP95CS66F P-LQFP100-1414-0.50D A(168h) A(168h) TMP95CS54F P-LQFP100-1414-0.50D A(168h) A(168h) TMP95PS54F P-LQFP100-1414-0.50D A(168h) A(168h) TMP95CU54AF P-LQFP100-1414-0.50D A(168h) A(168h) TMP95CW54AF P-LQFP100-1414-0.50D A(168h) A(168h) TMP95FW54AF P-LQFP100-1414-0.50E A(168h) A(168h) TMP94C241CF P-QFP160-2828-0.65A A(168h) A(168h) TMP94C251AF P-QFP144-2020-0.50 A(168h) A(168h) TMP94FU81F P-LQFP100-1414-0.50C A(168h) A(168h) TMP91CW18AF P-QFP80-1420-0.80B A(168h) A(168h) TMP91PW18AF P-QFP80-1420-0.80B GG TMP91CW12F P-LQFP100-1414-0.50C A(168h) A(168h) TMP91PW12F P-LQFP100-1414-0.50C B(72h) B(72h) TMP91CW12AF P-LQFP100-1414-0.50D A(168h) A(168h) TMP91FY12AF P-LQFP100-1414-0.50E A(168h) A(168h) TMP91CY22F P-LQFP100-1414-0.50D A(168h) A(168h) TMP91FY22F P-LQFP100-1414-0.50E A(168h) A(168h) TMP91CU10F P-LQFP100-1414-0.50C A(168h) A(168h) TMP91PW10F P-LQFP100-1414-0.50D A(168h) A(168h) TMP91CW11F P-LQFP100-1414-0.50C A(168h) A(168h) TMP91PW11F P-LQFP100-1414-0.50C GG TMP91C219F P-LQFP100-1414-0.50B A(168h) A(168h) TMP91C219F P-LQFP100-1414-0.50D A(168h) A(168h) TMP91C829F P-LQFP100-1414-0.50B A(168h) A(168h) TMP91C829F P-LQFP100-1414-0.50D A(168h) A(168h) TMP91C815F P-TQFP128-1414-0.40 A(168h) A(168h) TMP91C016F P-LQFP100-1414-0.50D A(168h) A(168h) TMP91C025F P-LQFP100-1414-0.50D A(168h) A(168h) TMP91C824F P-LQFP100-1414-0.50D A(168h) A(168h) Note 1: As of February, 2002 Note 2: Symbols A (168h), B (72h), C (48h), D (24h), E (12h), G and indicate the maximum permissible period between unpacking and mounting of the device, and the required storage conditions for the device. For details of these conditions, please refer to Table 2.2. |
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