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AND8116D Datasheet(PDF) 6 Page - ON Semiconductor |
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AND8116D Datasheet(HTML) 6 Page - ON Semiconductor |
6 / 8 page AND8116/D http://onsemi.com 6 The 73 V waveform shown in the oscilloscope picture (Figure 9) resulted from the 60 V load dump transient plus the vehicle’s battery voltage (13 V). In the application field, the relay driver (NUD3124) is always connected to relays, therefore if a load dump condition occurs, the current is limited by the relay’s coil resistance which reduces the amount of energy that the relay driver (NUD3124) needs to drain to ground. Figure 10 shows an oscilloscope picture with the waveforms generated across the NUD3124 device when it is subjected to a load dump transient. For this case, the device is controlling an OMRON relay (G8TB−1A−64) The most stressful and aggressive requirement for automotive transients is load dump. Therefore if a device is able to comply with this requirement, it is assured that it will sustain all the other less aggressive transients such as 240 V (10 W source impedance), 350 ms time−duration type. In addition to complying with the load dump transient requirements and all the other smaller automotive transients, the NUD3124 device also complies with other automotive requirements such as reverse battery (−14 V, 1 minute or more) and dual voltage jump start (24 V "10%). If a reverse battery condition occurs, it will cause the body diode of the FET to be forward biased and hence conduct. During this condition, the current will be limited by the relay’s coil resistance to a safe level causing the relay be energized. With the traditional discrete approach, damage can occur to the control logic circuitry due to a possible current path from a reverse connected battery through the driver to the logic’s output. This possibility is eliminated when the NUD3124 device is used. If a dual voltage jump start is used (24 V or more), the NUD3124 device will remain in its off−state and therefore the relays will too. This is the ideal operation required during a dual voltage jump start condition, otherwise the relays would be activated and could create serious operation problems in the equipment or functions that they are controlling (windows, seats, etc.). RELAY MODULE The benefits of the ON Semiconductor’s relay driver devices (NUD3105, NUD3112 and NUD3124) are even more unique and useful if they are integrated inside the relay body to create relay modules that can be driven directly from the logic circuitry. The advantages are: • No need for external driver device • PC board space reduction • Reduction for insertion operations. • Optimized design for lower cost All the previous advantages will result in costs reduction for industrial and automotive applications which have the need for mechanical relays. Figure 10 describes graphically the design of the relay module. Some relay manufacturers already integrate a diode connected in parallel with the relay’s coil to simplify the driver circuitry. Others are considering to develop the concept of the relay module. The major goal of the relay’s manufacturers is to offer more added value to their customers for design optimization and cost reduction. Load Dump Transient – 20 V/div ID – 100 mA/div Ppk = Ch2 x Ch3 Conversion factors: Ch1 – Direct (Volts) Ch2 – Max * 20 (Amp) Ch3 – Direct (Volts) M1 – Area * 20 (Joules) = 73 mJ VDS – 20V/div Figure 10. Waveforms Generated Across the NUD3124 Device During a Load Dump Transient |
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