unless otherwise noted

NOTE: UNLESS OTHERWISE SPECIFIED.

1. EPOXY COATING.

2. 63Sn/37Pb EUTECTIC BUMP.

3. RECOMMEND NON-SOLDER MASK DEFINED LANDING PAD.

4. PIN A1 IS ESTABLISHED BY LOWER LEFT CORNER WITH RESPECT TO TEXT ORIENTATION PINS ARE NUMBERED COUNTERCLOCKWISE.

5. XXX IN DRAWING NUMBER REPRESENTS PACKAGE SIZE VARIATION WHERE X1 IS PACKAGE WIDTH, X2 IS PACKAGE LENGTH AND X3 IS

PACKAGE HEIGHT.

6. REFERENCE JEDEC REGISTRATION MO-211. VARIATION BC.

4-Bump Thin micro SMD

NS Package Number TPA04GKA

X

X

X

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