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PE0603JKJ7T0R1L Datasheet(PDF) 10 Page - YAGEO Corporation |
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PE0603JKJ7T0R1L Datasheet(HTML) 10 Page - YAGEO Corporation |
10 / 12 page - Chip Resistor Surface Mount www.yageo.com Nov. 28, 2016 V.5 Product specification 10 12 SERIES PE_L 0201 /0402/ 0603/ 0805/ 1206/ 2010/ 2512 TESTS AND REQUIREMENTS TEST TEST METHOD PROCEDURE REQUIREMENTS Life/ Operational Life/ Endurance MIL-STD-202G-method 108 IEC 60115-1 4.25.1 1,000 hours at 70± 2 °C applied RCWV 1.5 hours on, 0.5 hour off, still air required ± (1%+0.0005 Ω) High Temperature Exposure/ Endurance at Upper Category Temperature MIL-STD-202G-method 108 IEC 60115-1 4.25.3 1,000 hours at maximum operating temperature depending on specification, unpowered No direct impingement of forced air to the parts Tolerances: 0201/0402 155± 3℃ 0603 and above 170± 3℃ ± (1%+0.0005 Ω) Moisture Resistance MIL-STD-202G-method 106 Each temperature / humidity cycle is defined at 8 hours (method 106F), 3 cycles / 24 hours for 10d with 25 °C / 65 °C 95% R.H, without steps 7a & 7b, unpowered Parts mounted on test-boards, without condensation on parts Measurement at 24± 2 hours after test conclusion ± (0.5%+0.0005 Ω) Thermal Shock MIL-STD-202G-method 107 -55/+125 °C Note: Number of cycles required is 300. Devices mounted Maximum transfer time is 20 seconds. Dwell time is 15 minutes. Air – Air ±(1%+0.0005 Ω) Short Time Overload IEC60115-1 4.13 5 times of rated power for 5 seconds at room temperature ± (1%+0.0005 Ω) No visible damage Board Flex/ Bending IEC60115-1 4.33 Device mounted on PCB test board as described, only 1 board bending required Bending for 0201: 3mm 0402 and above: 2mm Holding time: minimum 60 seconds ± (1%+0.0005 Ω) No visible damage Biased Humidity MIL-STD-202 Method 103 1,000 hours at 85ºC/85%R.H. 10% of operating power, no condensation on the devices, circulating air. ± (1.0 % + 0.0005Ω) Table 8 Test condition, procedure and requirements |
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