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PE0402JKM7T0R91L Datasheet(PDF) 11 Page - YAGEO Corporation |
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PE0402JKM7T0R91L Datasheet(HTML) 11 Page - YAGEO Corporation |
11 / 12 page - Chip Resistor Surface Mount www.yageo.com Nov. 28, 2016 V.5 Product specification 11 12 SERIES PE_L 0201 /0402/ 0603/ 0805/ 1206/ 2010/ 2512 TEST TEST METHOD PROCEDURE REQUIREMENTS Solderability - Wetting IPC/JEDEC J-STD-002B test B Electrical Test not required Magnification 50X SMD conditions: 1st step: method B, aging 4 hours at 155 °C dry heat 2nd step: leadfree solder bath at 245± 3 °C Dipping time: 3± 0.5 seconds Well tinned (≥95% covered) No visible damage - Leaching IPC/JEDEC J-STD-002B test D Leadfree solder, 260 °C, 30 seconds immersion time No visible damage - Resistance to Soldering Heat MIL-STD-202G-method 210F IEC 60115-1 4.18 Condition B, no pre-heat of samples Leadfree solder, 260 °C, 10 seconds immersion time Procedure 2 for SMD: devices fluxed and cleaned with isopropanol ± (0.5%+0.0005 Ω) No visible damage |
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