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LP3990TLX-1.5 Datasheet(PDF) 6 Page - National Semiconductor (TI) |
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LP3990TLX-1.5 Datasheet(HTML) 6 Page - National Semiconductor (TI) |
6 / 13 page Electrical Characteristics (Continued) Unless otherwise noted, V EN =950mV, VIN =VOUT + 1.0V, or 2.0V, whichever is higher. CIN = 1 µF, IOUT = 1 mA, COUT =0.47 µF. Typical values and limits appearing in normal type apply for T J = 27˚C. Limits appearing in boldface type apply over the full junction temperature range for operation, −40 to +125˚C. (Note 13) Symbol Parameter Conditions Typ Limit Units Min Max e n Output noise Voltage (Note 10) BW = 10Hz to 100kHz, V OUT = 0.8 60 µV RMS V OUT = 1.5 125 V OUT = 3.3 180 T SHUTDOWN Thermal Shutdown Temperature 155 ˚C Hysteresis 15 Enable Control Characteristics I EN (Note 12) Maximum Input Current at V EN Input V EN = 0.0V 0.001 0.1 µA V EN =6V 6 2.5 10 V IL Low Input Threshold V IN =2Vto6V 0.4 V V IH High Input Threshold V IN =2Vto6V 0.95 V Timing Characteristics T ON Turn On Time (Note 10) To 95% Level V IN(MIN) to 6.0V V OUT = 0.8 80 150 µs V OUT = 1.5 105 200 V OUT = 3.3 175 250 Transient Response Line Transient Response | δV OUT|Trise =Tfall = 30µs (Note 10) δV IN = 600mV 8 16 mV (pk - pk) Load Transient Response | δV OUT| T rise =Tfall = 1µs (Note 10)IOUT = 1mA to 150mA C OUT = 1µF 55 80 mV Note 1: Absolute Maximum Ratings are limits beyond which damage can occur. Operating Ratings are conditions under which operation of the device is guaranteed. Operating Ratings do not imply guaranteed performance limits. For guaranteed performance limits and associated test conditions, see the Electrical Characteristics tables. Note 2: All Voltages are with respect to the potential at the GND pin. Note 3: For further information on these packages please refer to the following application notes;AN-1112 Micro SMD Package Wafer Level Chip Scale Package,AN-1187 Leadless Leadframe Package. Note 4: Internal thermal shutdown circuitry protects the device from permanent damage. Note 5: The human body model is 100pF discharged through a 1.5k Ω resistor into each pin. The machine model is a 200pF capacitor discharged directly into each pin. Note 6: The maximum ambient temperature (TA(max)) is dependant on the maximum operating junction temperature (TJ(max-op) = 125˚C), the maximum power dissipation of the device in the application (PD(max)), and the junction to ambient thermal resistance of the part/package in the application (θJA), as given by the following equation: TA(max) =TJ(max-op) -(θJA xPD(max)). Note 7: Dropout voltage is voltage difference between input and output at which the output voltage drops to 100mV below its nominal value. This parameter only for output voltages above 2.0V. Note 8: Junction to ambient thermal resistance is dependant on the application and board layout. In applications where high maximum power dissipation is possible, special care must be paid to thermal dissipation issues in board design. Note 9: The device maintains the regulated output voltage without the load. Note 10: This electrical specification is guaranteed by design. Note 11: Short circuit current is measured with VOUT pulled to 0V and VIN worst case = 6.0V. Note 12: Enable Pin has 1M Ω typical, resistor connected to GND. Note 13: All limits are guaranteed. All electrical characteristics having room-temperature limits are tested during production at TJ = 25˚C or correlated using Statistical Quality Control methods. Operation over the temperature specification is guaranteed by correlating the electrical characteristics to process and temperature variations and applying statistical process control. Note 14: VIN(MIN) =VOUT(NOM) + 0.5V, or 2.0V, whichever is higher. Output Capacitor, Recommended Specifications Symbol Parameter Conditions Typ Limit Units Min Max C OUT Output Capacitor Capacitance (Note 15) -40˚C to +125˚C 1.0 0.68 µF 0˚C to +125˚C 0.47 0.33 ESR 5 500 m Ω www.national.com 6 |
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