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HFCT-5911ATLZ Datasheet(PDF) 4 Page - AVAGO TECHNOLOGIES LIMITED |
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HFCT-5911ATLZ Datasheet(HTML) 4 Page - AVAGO TECHNOLOGIES LIMITED |
4 / 16 page Package The overall package concept for the device consists of the following basic elements; two optical subassem- blies, two electrical subassemblies and the housing as illustrated in the block diagram in Figure 3. The package outline drawing and pin out are shown in Figures and 5. The details of this package outline and pin out are compliant with the multisource definition of the 2 x 5 DIP. The electrical subassemblies consist of high volume multilayer printed circuit boards on which the IC and various surface-mounted passive circuit elements are attached. The receiver electrical subassembly includes an internal shield for the electrical and optical subassembly to en- sure high immunity to external EMI fields. The optical subassemblies are each attached to their respective transmit or receive electrical subassemblies. These two units are then placed within the outer hous- ing of the transceiver. The outer housing of the trans- ceiver is molded with nonconductive plastic to provide mechanical strength. The housing is then encased with a metal EMI protective shield. The case is signal ground and we recommend soldering the four ground tabs to host card signal ground. Each electrical subassembly PCB carries the signal pins that exit from the bottom of the transceiver. The solder posts are fastened into the molding of the device. This design provides the mechanical strength required to withstand the additional stresses on the transceiver resulting from the insertion force of fiber cable mating. Although the solder posts are connected electrically to the transceiver, it is recommended that they are connected to the chassis ground. Figure 3. Block Diagram DATA OUT SIGNAL DETECT DATA IN DATA IN Tx DISABLE QUANTIZER IC LASER DRIVER AND CONTROL CIRCUIT PIN PHOTODIODE PREAMPLIFIER SUBASSEMBLY LASER OPTICAL SUBASSEMBLY DATA OUT LC RECEPTACLE R X SUPPLY T X SUPPLY R X GROUND T X GROUND LASER BIAS MONITORING LASER DIODE OUTPUT POWER MONITORING CASE * * NOSE CLIP PROVIDES CONNECTION TO CHASSIS GROUND FOR IMPROVED EMI PERFORMANCE |
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