Package

The overall package concept for the device consists of

the following basic elements; two optical subassem-

blies, two electrical subassemblies and the housing as

illustrated in the block diagram in Figure 3.

The package outline drawing and pin out are shown in

Figures  and 5. The details of this package outline and

pin out are compliant with the multisource definition of

the 2 x 5 DIP.

The electrical subassemblies consist of high volume

multilayer printed circuit boards on which the IC and

various surface-mounted passive circuit elements are

attached.

The receiver electrical subassembly includes an internal

shield for the electrical and optical subassembly to en-

sure high immunity to external EMI fields.

The optical subassemblies are each attached to their

respective transmit or receive electrical subassemblies.

These two units are then placed within the outer hous-

ing of the transceiver. The outer housing of the trans-

ceiver is molded with nonconductive plastic to provide

mechanical strength. The housing is then encased with

a metal EMI protective shield. The case is signal ground

and we recommend soldering the four ground tabs to

host card signal ground.

Each electrical subassembly PCB carries the signal pins

that exit from the bottom of the transceiver.

The solder posts are fastened into the molding of the

device. This design provides the mechanical strength

required to withstand the additional stresses on the

transceiver resulting from the insertion force of fiber

cable mating. Although the solder posts are connected

electrically to the transceiver, it is recommended that

they are connected to the chassis ground.

Figure 3. Block Diagram

DATA OUT

SIGNAL

DETECT

DATA IN

DATA IN

Tx DISABLE

QUANTIZER IC

LASER DRIVER

AND CONTROL

CIRCUIT

PIN PHOTODIODE

PREAMPLIFIER

SUBASSEMBLY

LASER

OPTICAL

SUBASSEMBLY

DATA OUT

LC

RECEPTACLE

R

T

R

T

LASER BIAS

MONITORING

LASER DIODE

OUTPUT POWER

MONITORING

CASE

*

* NOSE CLIP PROVIDES CONNECTION TO CHASSIS GROUND FOR IMPROVED EMI PERFORMANCE