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SF0603X102SBNB Datasheet(PDF) 11 Page - API Technologies Corp |
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SF0603X102SBNB Datasheet(HTML) 11 Page - API Technologies Corp |
11 / 21 page API TECHNOLOGIES • 8061 Avonia Rd. • Fairview, PA 16415 • Ph: 814-474-1571 • Fax: 814-474-3110 • eis.apitech.com API TECHNOLOGIES’ SPECTRUM CONTROL GmbH • Hansastrasse 6 • 91126 Schwabach, Germany • Phone: (49)-9122-795-0 • Fax: (49)-9122-795-58 SM11 Surface Mount Low Pass Filters MSM Series .049 (1.25±0.2) .078 (2.0±0.2) .049 (1.25±0.2) .007 (0.2±0.1) .007 (0.2±0.1) Working Voltage . . . . . . . . . . 50 VDC Test Voltage . . . . . . . . . . . . 150 VDC Current Rating . . . . . . . . . . 10 Amps max. Insulation Resistance. . . . . . 1.0 MΩ Terminations. . . . . . . . . . . . Ni-Barrier Soldering Conditions . . . . . . Max. 250˚C-5 sec. MSM Output Input Ground Feed-through MSM Ordering Information Length (L) Max. Top side chip GND Copper foil pattern 0.3 GND 0.6 2.6 PO.8 GND Copper foil pattern 0.3 GND 0.6 2.6 chip Bottom side Ground pattern Ground pattern Through hole Through hole Top side Bottom side Full-face ground Bottom side Surface .098 (2.5) Through hole .023 (ø 0.6) .047 (1.2) .031 (0.8) .058 (1.5) .110 (2.8) .070 (1.8) Copper foil pattern Resist Unit: mm Size difference: ±0.1 Thickness of copper foil: 35µm Chip ø .045 (1.15±0.05) Center hole .057 (1.45±0.2) .157 (4.0±0.1) .078 (2.00±0.05) ø .058 (1.5±0.1-0) .137 (3.50±.05) .068 (1.75±0.1) .023 (0.6) Max. .117 (3.0) Max. .157 (4.0±0.1) Dimensions in inches (mm) .049 (1.25±0.2) .078 (2.0±0.2) .049 (1.25±0.2) .007 (0.2±0.1) .007 (0.2±0.1) Dimensions in inches (mm) MSM 50 40 20 30 10 0 1 10000 Frequency (MHz) 10 100 1000 60 102Z 151M 470M 271M MSM Recommended Board Pattern MSM Tape and Reel Packaging Length (L) Max. Top side chip GND Copper foil pattern 0.3 GND 0.6 2.6 PO.8 GND Copper foil pattern 0.3 GND 0.6 2.6 chip Bottom side Ground pattern Ground pattern Through hole Through hole Top side Bottom side Full-face ground Bottom side Surface .098 (2.5) Through hole .023 (ø 0.6) .047 (1.2) .031 (0.8) .058 (1.5) .110 (2.8) .070 (1.8) Copper foil pattern Resist Unit: mm Size difference: ±0.1 Thickness of copper foil: 35µm Chip ø .045 (1.15±0.05) Center hole .057 (1.45±0.2) .157 (4.0±0.1) .078 (2.00±0.05) ø .058 (1.5±0.1-0) .137 (3.50±.05) .068 (1.75±0.1) .023 (0.6) Max. .117 (3.0) Max. .157 (4.0±0.1) Note: Exclusively for reflow soldering Specifications PartNumber Temperature Capacitance Capacitance Current RatedRating Temperature Characteristics Tolerance Rating Rating Range MSM4T470M10 T 47pF -55/+125˚C MSM4R151M10 R 150pF +50/-20% 10A 50VDC -55/+125˚C MSM4R271M10 R 270pF -55/+125˚C MSM4V102M10 V 1000pF -25/+85˚C Insertion Loss MSM 4T 470M 10 T Style MSM (Miniature) Capacitance Circuit Configuration 4-Feed-Through Current Rating 10 Amps Value 47 pF Tolerance +50/- 20% Packaging T-TapeandReel 2,000 pcs/reel B-Bulkpack 1,000pcs/reel Temperature Characteristic R-+/-15% T-+22/-33% V-+22/-82% |
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