www.pulseelectronics.com

WC706.C (01/16)

Pulse Jack

E l e c t r o n i c s

CHIP FERRITE BEADS

6.1 Lead Free Solder re-flow

Recommended temperature profiles for lead free re-flow soldering in Figure 1. Reflow times: 3 times max

Pre-heating

SolderingNatural Cooling

TP (260 C/ 10s max.)

60~150s

tp (245 C/ 20~40s.)

60~180s

480s max.

TIME( sec.)

217

200

150

Figure 1

6.2 Solder Iron

Products attachment with a soldering iron is discouraged due to the inherent process control limitations. If a

soldering iron must be employed the following precautions are recommended. For Iron Soldering in Figure 2.

Figure 2(1 time max)

350

150

TIME( sec.)

Gradual Cooling

Over 60s

Within 4~5s

Pre-heatingSoldering

Natural Cooling

• Preheat circuit and products to 150�C

• 350�C tip temperature (max)

• Never contact the ceramic with

the iron flip

• 1.00mm tip diameter (max)

• Use a 20 watt soldering iron

with tip diameter of 1.0mm

• Limited soldering time to

4~5sec

6.3 Solder Volume

Accordingly increasing the solder volume, the mechanical

stress to product is also increased. Exceeding solder

volume may cause the failure of mechanical or electrical

performance. Solder shall be used not to be exceed as

shown in the right side:

Minimum fillet height = soldering thickness + 25% product

height

6