6

020217

B

D

A

C

A

GiGuard - ESD Protection for High Speed Circuits

TEMPERATURE DERATING

DIMENSIONS

RECOMMENDED REFLOW SOLDER PAD

L

W

T

t

Size

Length (L)

Width (W)

Thick (T)

Termination (t)

0201

0.60 ± 0.03

0.30 ± 0.03

0.30 ± 0.03

0.15 ± 0.05

(0.024 ± 0.001) (0.012 ± 0.001) (0.012 ± 0.001) (0.006 ± 0.002)

0402

1.00 ± 0.05

0.60 ± 0.05

0.50 ± 0.05

0.20 ± 0.05

(0.039 ± 0.002) (0.024 ± 0.002) (0.020 ± 0.002) (0.008 ± 0.002)

mm (inches)

Size

A

B

C

D

0201

0.25 ± 0.05

0.30 ± 0.05

0.80 ± 0.15

0.275 ± 0.025

(0.010 ± 0.002) (0.012 ± 0.002) (0.031 ± 0.006) (0.011 ± 0.001)

0402

0.61 ± 0.05

0.51 ± 0.05

1.70 ± 0.05

0.51 ± 0.05

(0.024 ± 0.002) (0.020 ± 0.002) (0.067 ± 0.002) (0.020 ± 0.002)

mm (inches)

RECOMMENDED SOLDER REFLOW PROFILES

Recommended Reflow Profiles

Time / secs

25

50

75

100

125

150

175

200

225

250

275

0

20

40

60

80

100

120

140

160

180

200

220

240

260

280

300

320

340

360

380

400

420

Pb Free Recommended

Pb Free Max with care

Sn Pb Recommended

Hand Soldering Cautions

In hand soldering of the Devices. Large temperature gradient

between preheated the Devices and the tip of soldering iron

may cause electrical failures and mechanical damages such as

cracking or breaking of the devices. The soldering shall be

carefully controlled and carried out so that the temperature

gradient is kept minimum with following recommended

conditions for hand soldering.

RECOMMENDED SOLDERING CONDITION 1

(1) Solder: 0.12~0.18mm Thread solder (Sn96.5:Ag3.5) with

soldering flux in the core Rosin-based and non-activated

flux is recommended.

(2) Preheating: The Devices shall be preheated so that

Temperature Gradient between the devices and the tip of

soldering iron is 150℃ or below.

(3) Soldering Iron: Rated Power of 20w max with 3mm

soldering tip in diameter. Temperature of soldering iron tip

300ºCmax, 3-5sec (The required amount of solder shall be

melted in advance on the soldering tip.)

(4) Cooling: After soldering. The Devices shall be cooled

gradually at room ambient temperature.

RECOMMENDED SOLDERING CONDITION 2 –

WITHOUT PREHEATING

(1) Temperature of soldering iron tip 300℃max, 3-5sec.

(2) Solder iron tip shall not directly touch to Devices.

(3) Solder iron tip shall be fully preheated before soldering while

soldering iron tip to the external electrode of Devices.