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GG0402050R3C2P Datasheet(PDF) 6 Page - AVX Corporation |
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GG0402050R3C2P Datasheet(HTML) 6 Page - AVX Corporation |
6 / 8 page 6 020217 B D A C A GiGuard - ESD Protection for High Speed Circuits TEMPERATURE DERATING DIMENSIONS RECOMMENDED REFLOW SOLDER PAD L W T t Size Length (L) Width (W) Thick (T) Termination (t) 0201 0.60 ± 0.03 0.30 ± 0.03 0.30 ± 0.03 0.15 ± 0.05 (0.024 ± 0.001) (0.012 ± 0.001) (0.012 ± 0.001) (0.006 ± 0.002) 0402 1.00 ± 0.05 0.60 ± 0.05 0.50 ± 0.05 0.20 ± 0.05 (0.039 ± 0.002) (0.024 ± 0.002) (0.020 ± 0.002) (0.008 ± 0.002) mm (inches) Size A B C D 0201 0.25 ± 0.05 0.30 ± 0.05 0.80 ± 0.15 0.275 ± 0.025 (0.010 ± 0.002) (0.012 ± 0.002) (0.031 ± 0.006) (0.011 ± 0.001) 0402 0.61 ± 0.05 0.51 ± 0.05 1.70 ± 0.05 0.51 ± 0.05 (0.024 ± 0.002) (0.020 ± 0.002) (0.067 ± 0.002) (0.020 ± 0.002) mm (inches) RECOMMENDED SOLDER REFLOW PROFILES Recommended Reflow Profiles Time / secs 25 50 75 100 125 150 175 200 225 250 275 0 20 40 60 80 100 120 140 160 180 200 220 240 260 280 300 320 340 360 380 400 420 Pb Free Recommended Pb Free Max with care Sn Pb Recommended Hand Soldering Cautions In hand soldering of the Devices. Large temperature gradient between preheated the Devices and the tip of soldering iron may cause electrical failures and mechanical damages such as cracking or breaking of the devices. The soldering shall be carefully controlled and carried out so that the temperature gradient is kept minimum with following recommended conditions for hand soldering. RECOMMENDED SOLDERING CONDITION 1 (1) Solder: 0.12~0.18mm Thread solder (Sn96.5:Ag3.5) with soldering flux in the core Rosin-based and non-activated flux is recommended. (2) Preheating: The Devices shall be preheated so that Temperature Gradient between the devices and the tip of soldering iron is 150℃ or below. (3) Soldering Iron: Rated Power of 20w max with 3mm soldering tip in diameter. Temperature of soldering iron tip 300ºCmax, 3-5sec (The required amount of solder shall be melted in advance on the soldering tip.) (4) Cooling: After soldering. The Devices shall be cooled gradually at room ambient temperature. RECOMMENDED SOLDERING CONDITION 2 – WITHOUT PREHEATING (1) Temperature of soldering iron tip 300℃max, 3-5sec. (2) Solder iron tip shall not directly touch to Devices. (3) Solder iron tip shall be fully preheated before soldering while soldering iron tip to the external electrode of Devices. |
Similar Description - GG0402050R3C2P |
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