bq24200, bq24201, bq24202

bq24203, bq24204, bq24205

SLUS501A – OCTOBER 2001

2

www.ti.com

AVAILABLE OPTIONS

TJ

CHARGE

REGULATION

VOLTAGE

OPTIONAL

FUNCTIONS

MARKING

PACKAGED

DEVICES

(DGN)

4.2 V

STAT and TS

AZC

bq24200DGN

4.1 V

STAT and TS

AZD

bq24201DGN

40

_C to 125_C

4.2 V

STAT

AZE

bq24202DGN

–40

_C to 125_C

4.1 V

STAT

AZF

bq24203DGN

4.2 V

–

AZG

bq24204DGN

4.1 V

–

AZI

bq24205DGN

† The DGN package is available taped and reeled. Add TR suffix to device type (e.g. bq24200DGNTR) to order. Quantities

2500 devices per reel.

OUT

BAT

CE

N/C

8

7

6

5

1

2

3

4

IN

N/C

bq24200, bq24201

HTSSOP (DGN) PACKAGE

(TOP VIEW)

OUT

BAT

TS

N/C

8

7

6

5

1

2

3

4

IN

STAT

OUT

BAT

CE

N/C

8

7

6

5

1

2

3

4

IN

STAT

bq24202, bq24203

HTSSOP (DGN) PACKAGE

(TOP VIEW)

bq24204, bq24205

HTSSOP (DGN) PACKAGE

(TOP VIEW)

*

*

*

* Thermal pad is electrically connected to the ground of the device (VSS).

Terminal Functions

TERMINAL

NO.

I/O

DESCRIPTION

NAME

bq24200

bq24201

bq24202

bq24203

bq24204

bq24205

I/O

DESCRIPTION

BAT

7

7

7

I

Battery voltage sense input

CE

–

6

6

I

Charge enable Input (active low)

IN

1

1

1

I

Charge input voltage

N/C

5

5

3, 5

–

No connection. Must be left floating

OUT

8

8

8

O

Charge current output

STAT

3

3

–

O

Charge status output

TS

6

–

–

I

Temperature sense input

VCC

2

2

2

I

VCC input

VSS

4

4

4

–

Ground input

Supply voltage (Vcc with respect to GND)

16.5 V

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Input voltage, IN, STAT, TS (all with respect to GND)

16.5 V

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Input voltage, BAT, OUT (all with respect to GND)

7 V

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Output sink/source current (STAT)

15 mA

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

–65

_C to 150_C

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

–40

_C to 125_C

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Lead temperature (soldering, 10sec)

300

_C

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

† Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and

functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not

implied. Exposure to absolute–maximum–rated conditions for extended periods may affect device reliability.