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BQ24204 Datasheet(PDF) 2 Page - Texas Instruments |
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BQ24204 Datasheet(HTML) 2 Page - Texas Instruments |
2 / 14 page bq24200, bq24201, bq24202 bq24203, bq24204, bq24205 SLUS501A – OCTOBER 2001 2 www.ti.com AVAILABLE OPTIONS TJ CHARGE REGULATION VOLTAGE OPTIONAL FUNCTIONS MARKING PACKAGED DEVICES (DGN) 4.2 V STAT and TS AZC bq24200DGN 4.1 V STAT and TS AZD bq24201DGN 40 _C to 125_C 4.2 V STAT AZE bq24202DGN –40 _C to 125_C 4.1 V STAT AZF bq24203DGN 4.2 V – AZG bq24204DGN 4.1 V – AZI bq24205DGN † The DGN package is available taped and reeled. Add TR suffix to device type (e.g. bq24200DGNTR) to order. Quantities 2500 devices per reel. OUT BAT CE N/C 8 7 6 5 1 2 3 4 IN VCC N/C VSS bq24200, bq24201 HTSSOP (DGN) PACKAGE (TOP VIEW) OUT BAT TS N/C 8 7 6 5 1 2 3 4 IN VCC STAT VSS OUT BAT CE N/C 8 7 6 5 1 2 3 4 IN VCC STAT VSS bq24202, bq24203 HTSSOP (DGN) PACKAGE (TOP VIEW) bq24204, bq24205 HTSSOP (DGN) PACKAGE (TOP VIEW) * * * * Thermal pad is electrically connected to the ground of the device (VSS). Terminal Functions TERMINAL NO. I/O DESCRIPTION NAME bq24200 bq24201 bq24202 bq24203 bq24204 bq24205 I/O DESCRIPTION BAT 7 7 7 I Battery voltage sense input CE – 6 6 I Charge enable Input (active low) IN 1 1 1 I Charge input voltage N/C 5 5 3, 5 – No connection. Must be left floating OUT 8 8 8 O Charge current output STAT 3 3 – O Charge status output TS 6 – – I Temperature sense input VCC 2 2 2 I VCC input VSS 4 4 4 – Ground input absolute maximum ratings over operating free–air temperature range (unless otherwise noted)† Supply voltage (Vcc with respect to GND) 16.5 V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Input voltage, IN, STAT, TS (all with respect to GND) 16.5 V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Input voltage, BAT, OUT (all with respect to GND) 7 V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Output sink/source current (STAT) 15 mA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Storage temperature range, Tstg –65 _C to 150_C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Junction temperature range, TJ –40 _C to 125_C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Lead temperature (soldering, 10sec) 300 _C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . † Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute–maximum–rated conditions for extended periods may affect device reliability. |
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