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H3LIS100DL Datasheet(PDF) 15 Page - STMicroelectronics |
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H3LIS100DL Datasheet(HTML) 15 Page - STMicroelectronics |
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15 / 38 page  DocID027504 Rev 2 15/38 H3LIS100DL Functionality 38 3 Functionality The H3LIS100DL is a “nano”, low-power, digital output 3-axis linear accelerometer housed in an LGA package. The complete device includes a sensing element and an IC interface able to take the information from the sensing element and to provide a signal to the external world through an I2C/SPI serial interface. 3.1 Sensing element A proprietary process is used to create a surface micromachined accelerometer. The technology allows processing suspended silicon structures, which are attached to the substrate in a few points called anchors and are free to move in the direction of the sensed acceleration. To be compatible with traditional packaging techniques, a cap is placed on top of the sensing element to avoid blocking the moving parts during the molding phase of the plastic encapsulation. When an acceleration is applied to the sensor, the proof mass displaces from its nominal position, causing an imbalance in the capacitive half bridge. This imbalance is measured using charge integration in response to a voltage pulse applied to the capacitor. At steady-state the nominal value of the capacitors are a few pF and when an acceleration is applied, the maximum variation of the capacitive load is in the fF range. 3.2 IC interface The complete measurement chain is composed of a low-noise capacitive amplifier which converts the capacitive unbalancing of the MEMS sensor into an analog voltage that will be available to the user through an analog-to-digital converter. The acceleration data may be accessed through an I2C/SPI interface, making the device particularly suitable for direct interfacing with a microcontroller. The H3LIS100DL features a data-ready signal (RDY) which indicates when a new set of measured acceleration data is available, therefore simplifying data synchronization in the digital system that uses the device. 3.3 Factory calibration The IC interface is factory calibrated for sensitivity (So) and zero-g level (TyOff). The trim values are stored inside the device in non-volatile memory. Any time the device is turned on, the trim parameters are downloaded into the registers to be used during active operation. This allows the device to be used without further calibration. |
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