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AMC1301 Datasheet(PDF) 4 Page - Texas Instruments |
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AMC1301 Datasheet(HTML) 4 Page - Texas Instruments |
4 / 34 page 4 AMC1301-Q1 SBAS792A – APRIL 2017 – REVISED APRIL 2017 www.ti.com Product Folder Links: AMC1301-Q1 Submit Documentation Feedback Copyright © 2017, Texas Instruments Incorporated (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. 6 Specifications 6.1 Absolute Maximum Ratings (1) MIN MAX UNIT Supply voltage, VDD1 to GND1 or VDD2 to GND2 –0.3 7 V Analog input voltage at VINP, VINN GND1 – 6 VDD1 + 0.5 V Input current to any pin except supply pins –10 10 mA Junction temperature, TJ 150 °C Storage temperature, Tstg –65 150 °C (1) AEC Q100-002 indicates HBM stressing is done in accordance with the ANSI/ESDA/JEDEC JS-001 specification. 6.2 ESD Ratings VALUE UNIT V(ESD) Electrostatic discharge Human body model (HBM), per AEC Q100-002(1) ±2000 V Charged device model (CDM), per AEC Q100-011 ±1000 6.3 Recommended Operating Conditions over operating ambient temperature range (unless otherwise noted) MIN NOM MAX UNIT VDD1 High-side supply voltage (VDD1 to GND1) 3.0 5.0 5.5 V VDD2 Low-side supply voltage (VDD2 to GND2) 3.0 3.3 5.5 V TA Operating ambient temperature –40 125 °C (1) For more information about traditional and new thermal metrics, see Semiconductor and IC Package Thermal Metrics, SPRA953. 6.4 Thermal Information THERMAL METRIC(1) AMC1301-Q1 UNIT DWV (SOIC) 8 PINS RθJA Junction-to-ambient thermal resistance 110.1 °C/W RθJC(top) Junction-to-case (top) thermal resistance 51.7 °C/W RθJB Junction-to-board thermal resistance 66.4 °C/W ψJT Junction-to-top characterization parameter 16.0 °C/W ψJB Junction-to-board characterization parameter 64.5 °C/W RθJC(bot) Junction-to-case (bottom) thermal resistance N/A °C/W 6.5 Power Ratings PARAMETER TEST CONDITIONS VALUE UNIT PD Maximum power dissipation (both sides) VDD1 = VDD2 = 5.5 V 81.4 mW PD1 Maximum power dissipation (high-side supply) 45.65 mW PD2 Maximum power dissipation (low-side supply) 35.75 mW |
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