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R46KN322000H4M Datasheet(PDF) 8 Page - Kemet Corporation |
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R46KN322000H4M Datasheet(HTML) 8 Page - Kemet Corporation |
8 / 16 page © KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com F3006_R46_X2_275_125C • 10/18/2016 8 Metallized Polypropylene Film EMI Suppression Capacitors R46 Series, Class X2, 275 VAC, 125ºC Manual Soldering Recommendations Following is the recommendation for manual soldering with a soldering iron. The soldering iron tip temperature should besetat350°C(+10°Cmaximum)withthe soldering duration not to exceed more than 3 seconds. Recommended Soldering Temperature 0 50 100 150 200 250 300 350 400 0 1 2 3 4 5 6 7 8 Soldering time (seconds) Soldering Process The implementation of the RoHS directive has resulted in the selection of SnAgCu (SAC) alloys or SnCu alloys as primary solder.Thishasincreasedtheliquidustemperaturefromthatof183ºCforSnPbeutecticalloyto217–221ºCforthenew alloys.Asaresult,theheatstresstothecomponents,eveninwavesoldering,hasincreasedconsiderablyduetohigherpre- heat and wave temperatures. Polypropylene capacitors are especially sensitive to heat (the melting point of polypropylene is160–170ºC).Wavesolderingcanbedestructive,especiallyformechanicallysmallpolypropylenecapacitors(withlead spacingof5mmto15mm),andgreatcarehastobetakenduringsoldering.TherecommendedsolderprofilesfromKEMET shouldbeused.PleaseconsultKEMETwithanyquestions.Ingeneral,thewavesolderingcurvefromIECPublication61760- 1 Edition 2 serves as a solid guideline for successful soldering. Please see Figure 1. Reflowsolderingisnotrecommendedforthrough-holefilmcapacitors.Exposingcapacitorstoasolderingprofileinexcess oftheabovetherecommendedlimitsmayresulttodegradationorpermanentdamagetothecapacitors. Do not place the polypropylene capacitor through an adhesive curing oven to cure resin for surface mount components. Insertthrough-holepartsafterthecuringofsurfacemountparts.ConsultKEMETtodiscusstheactualtemperatureprofile in the oven, if through-hole components must pass through the adhesive curing process. A maximum two soldering cycles is recommended.Pleaseallowtimeforthecapacitorsurfacetemperaturetoreturntoanormaltemperaturebeforethesecond soldering cycle. Wave Soldering Recommendations 0 50 100 150 200 250 300 0 40 80 120 160 200 240 Time (s) ca 2 °C/s ca 3.5 °C/s typical ca 5 °C/s Cooling 2+3s max 115 °C max Tpreheat ∆T <150 °C 100 °C Preheating Typical Firstwave Second wave 260 °C |
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