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TLV70225DSET Datasheet(PDF) 4 Page - Texas Instruments |
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TLV70225DSET Datasheet(HTML) 4 Page - Texas Instruments |
4 / 33 page TLV702 SLVSAG6C – SEPTEMBER 2010 – REVISED MARCH 2015 www.ti.com 6 Specifications 6.1 Absolute Maximum Ratings over operating junction temperature range (unless otherwise noted) (1) MIN MAX UNIT IN –0.3 6 Voltage(2) EN –0.3 6 V OUT –0.3 6 Current (source) OUT Internally limited Output short-circuit duration Indefinite Total continuous power dissipation See Thermal Information Operating virtual junction, TJ –55 150 Temperature °C Storage, Tstg –55 150 (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods my affect device reliability. (2) All voltages are with respect to network ground terminal. 6.2 ESD Ratings VALUE UNIT Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all pins(1) ±2000 V(ESD) Electrostatic discharge V Charged device model (CDM), per JEDEC specification JESD22-C101, ±500 all pins(2) (1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. (2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. 6.3 Recommended Operating Conditions over operating free-air temperature range (unless otherwise noted). MIN NOM MAX UNIT VIN 2 5.5 V VOUT 1.2 4.8 V IOUT 0 300 mA 6.4 Thermal Information TLV702 THERMAL METRIC(1) DBV (SOT-23) DSE (WSON) UNIT 5 PINS 6 PINS RθJA Junction-to-ambient thermal resistance 249.2 321.3 RθJC(top) Junction-to-case (top) thermal resistance 136.4 207.9 RθJB Junction-to-board thermal resistance 85.9 281.5 °C/W ψJT Junction-to-top characterization parameter 19.5 42.4 ψJB Junction-to-board characterization parameter 85.3 284.8 RθJC(bot) Junction-to-case (bottom) thermal resistance N/A 142.3 (1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953. 4 Submit Documentation Feedback Copyright © 2010–2015, Texas Instruments Incorporated Product Folder Links: TLV702 |
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