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OMAP3525ECBC Datasheet(PDF) 3 Page - Texas Instruments |
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OMAP3525ECBC Datasheet(HTML) 3 Page - Texas Instruments |
3 / 265 page OMAP3530, OMAP3525 www.ti.com SPRS507H – FEBRUARY 2008 – REVISED OCTOBER 2013 • 65-nm CMOS Technologies .65-mm Ball Pitch (Top), .5-mm Ball Pitch (Bottom) • Package-On-Package (POP) Implementation for Memory Stacking (Not Available in CUS – 423-pin s-PBGA Package (CUS Suffix), Package) .65-mm Ball Pitch • Discrete Memory Interface (Not Available in • 1.8-V I/O and 3.0-V (MMC1 Only), CBC Package) 0.985-V to 1.35-V Adaptive Processor Core Voltage • Packages: 0.985-V to 1.35-V Adaptive Core Logic Voltage – 515-pin s-PBGA Package (CBB Suffix), Note: These are default Operating Performance .5-mm Ball Pitch (Top), .4-mm Ball Pitch Point (OPP) voltages and could be optimized to (Bottom) lower values using SmartReflex AVS. – 515-pin s-PBGA Package (CBC Suffix), 1.2 Applications • Portable Navigation Devices • Portable Media Player • Digital Video Camera • Portable Data Collection • Point-of-Sale Devices • Gaming • Web Tablet • Smart White Goods • Smart Home Controllers Copyright © 2008–2013, Texas Instruments Incorporated OMAP3530 and OMAP3525 Applications Processors 3 Submit Documentation Feedback Product Folder Links: OMAP3530 OMAP3525 |
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