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RC1206FR-7N1MP Datasheet(PDF) 7 Page - YAGEO Corporation |
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RC1206FR-7N1MP Datasheet(HTML) 7 Page - YAGEO Corporation |
7 / 8 page Chip Resistor Surface Mount www.yageo.com Aug. 22, 2014 V.0 Product specification 7 8 SERIES RC_P 0100 to 2512 TEST TEST METHOD PROCEDURE REQUIREMENTS Solderability - Wetting IPC/JEDECJ-STD-002B test B IEC 60068-2-58 Electrical Test not required Magnification 50X SMD conditions: 1st step: method B, aging 4 hours at 155 °C dry heat 2nd step: leadfree solder bath at 245± 3 °C Dipping time: 3± 0.5 seconds W ell tinned (>95% covered) No visible damage -Leaching IPC/JEDECJ-STD-002B test D IEC 60068-2-58 Leadfree solder ,260°C, 30 seconds immersion time No visible damage -Resistance to Soldering Heat MIL-STD-202F Method 210F IEC 60068-2-58 Condition B, no pre-heat of samples Leadfree solder, 260 °C ± 5℃, 10 ± 1 seconds immersion time Procedure 2 for SMD: devices fluxed and cleaned with isopropanol ± (0.5%+0.05Ω ) for D/F tol ± (1%+0.05Ω ) for J tol <50mR for jumper No visible damage |
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