4

bq294602, bq294604, bq294682, bq294624

SLUSAS0D – DECEMBER 2011 – REVISED APRIL 2017

www.ti.com

Product Folder Links: bq294602 bq294604 bq294682 bq294624

Submit Documentation Feedback

Copyright © 2011–2017, Texas Instruments Incorporated

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

7 Specifications

7.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)

(1)

MIN

MAX

UNIT

Supply voltage

VDD–VSS

–0.3

30

V

Input voltage

V1–VSS

–0.3

8

V

Output voltage

OUT–VSS

–0.3

30

V

See Thermal

Information

Functional temperature

–65

110

°C

300

°C

–65

150

°C

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

7.2 ESD Ratings

VALUE

UNIT

Electrostatic discharge

±2000

V

±500

(1)

See Typical Application.

7.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

MAX

UNIT

(1)

3

8

V

Input voltage

V1–VSS

0

5

V

–40

110

°C

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

7.4 Thermal Information

bq2946xx

UNIT

DRV (SON)

6 PINS

Junction-to-ambient thermal resistance

186.4

°C/W

Junction-to-case(top) thermal resistance

90.4

°C/W

Junction-to-board thermal resistance

110.7

°C/W

Junction-to-top characterization parameter

96.7

°C/W

Junction-to-board characterization parameter

90

°C/W

Junction-to-case(bottom) thermal resistance

n/a

°C/W