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CC2591RGV Datasheet(PDF) 5 Page - Texas Instruments |
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CC2591RGV Datasheet(HTML) 5 Page - Texas Instruments |
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5 / 25 page  CC2591 www.ti.com SWRS070B – MARCH 2008 – REVISED SEPTEMBER 2014 3.1 Pin Attributes Table 3-1. Pin Attributes TERMINAL TYPE DESCRIPTION NO. NAME The exposed die attach pad must be connected to a solid ground plane. See — GND Ground CC2591EM reference design for recommended layout. 1 2.0 V – 3.6 V Power. PCB trace to this pin serves as inductive load to PA . See AVDD_PA1 Power CC2591EM reference design for recommended layout. 2 RF_N RF RF interface towards CC24xx or CC25xx device. RXTX switching voltage when connected to CC24xx devices. See Table 5-2 and 3 RXTX Analog/Control Table 5-3 for details. 4 RF_P RF RF interface towards CC24xx or CC25xx device 5 PAEN Digital Input Digital control pin. See Table 5-2 and Table 5-3 for details. 6 EN Digital Input Digital control pin. See Table 5-2 and Table 5-3 for details. Digital control pin. 7 HGM Digital Input HGM=1 → Device in High Gain Mode HGM=0 → Device in Low Gain Mode (RX only) Secondary ground connections. Should be shorted to the die attach pad on the top 8, 9, 12, 14 GND Ground PCB layer. 2.0 V – 3.6 V Power. PCB trace to this pin serves as inductive load to PA. See 10 AVDD_PA2 Power CC2591EM reference design for recommended layout. 11 ANT RF Antenna interface. 2 V – 3.6 V Power. PCB trace to this pin serves as inductive load to LNA. See 13 AVDD_LNA Power CC2591EM reference design for recommended layout. 15 BIAS Analog Biasing input. Resistor between this node and ground sets bias current to PAs. 16 AVDD_BIAS Power 2 V – 3.6 V Power. Copyright © 2008–2014, Texas Instruments Incorporated Terminal Configuration and Functions 5 Submit Documentation Feedback Product Folder Links: CC2591 |
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