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CDCM61001 Datasheet(PDF) 3 Page - Texas Instruments |
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CDCM61001 Datasheet(HTML) 3 Page - Texas Instruments |
3 / 35 page CDCM61001 www.ti.com SCAS869F – FEBRUARY 2009 – REVISED JUNE 2011 AVAILABLE OPTIONS(1) TA PACKAGED DEVICES FEATURES(2) CDCM61001RHBT 32-pin QFN (RHB) package, small tape and reel –40°C to +85°C CDCM61001RHBR 32-pin QFN (RHB) package, tape and reel (1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or visit the device product folder at ti.com. (2) These packages conform to Lead (Pb)-free and green manufacturing specifications. Additional details including specific material content can be accessed at www.ti.com/leadfree. GREEN: TI defines Green to mean Lead (Pb)-Free and in addition, uses less package materials that do not contain halogens, including bromine (Br), or antimony (Sb) above 0.1%of total product weight. N/A: Not yet available Lead (Pb)-Free; for estimated conversion dates, go to www.ti.com/leadfree. Pb-FREE: TI defines Lead (Pb)-Free to mean RoHS compatible, including a lead concentration that does not exceed 0.1% of total product weight, and, if designed to be soldered, suitable for use in specified lead-free soldering processes. ABSOLUTE MAXIMUM RATINGS (1) Over operating free-air temperature range (unless otherwise noted). PARAMETER VALUE UNIT VCC_OUT, VCC_PLL1, VCC_PLL2, Supply voltage range(2) –0.5 to +4.6 V VCC_VCO, VCC_IN VIN Input voltage range(3) –0.5 to (VCC_IN + 0.5) V VOUT Output voltage range(3) –0.5 to (VCC_OUT + 0.5) V IIN Input current 20 mA IOUT Output current 50 mA TSTG Storage temperature range –65 to +150 °C (1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating condition is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) All supply voltages must be supplied simultaneously. (3) Input and output negative voltage ratings may be exceeded if the input and output clamp-current ratings are observed. RECOMMENDED OPERATING CONDITIONS Over operating free-air temperature range (unless otherwise noted). PARAMETER MIN NOM MAX UNIT VCC_OUT Output supply voltage 3.0 3.30 3.60 V VCC_PLL1 PLL supply voltage 3.0 3.30 3.60 V VCC_PLL2 PLL supply voltage 3.0 3.30 3.60 V VCC_VCO On-chip VCO supply voltage 3.0 3.30 3.60 V VCC_IN Input supply voltage 3.0 3.30 3.60 V TA Ambient temperature –40 +85 °C DISSIPATION RATINGS (1) (2) VALUE TEST 4 × 4 VIAS PARAMETER CONDITIONS ON PAD UNIT θJA Thermal resistance, junction-to-ambient 0 LFM 35 °C/W θJP (3) Thermal resistance, junction-to-pad 4 °C/W (1) The package thermal resistance is calculated in accordance with JESD 51 and JEDEC 2S2P (high-K board). (2) Connected to GND with nine thermal vias (0.3-mm diameter). (3) θJP (junction-to-pad) is used for the QFN package, because the primary heat flow is from the junction to the GND pad of the QFN package. Copyright © 2009–2011, Texas Instruments Incorporated 3 |
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Similar Description - CDCM61001_17 |
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