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CC2591RGVTG4 Datasheet(PDF) 7 Page - Texas Instruments |
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CC2591RGVTG4 Datasheet(HTML) 7 Page - Texas Instruments |
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7 / 25 page  CC2591 www.ti.com SWRS070B – MARCH 2008 – REVISED SEPTEMBER 2014 Electrical Characteristics (continued) TC = 25°C, VDD = 3 V , fRF= 2440 MHz (unless otherwise noted). Measured on CC2591EM reference design including external matching components. PARAMETER TEST CONDITIONS MIN TYP MAX UNIT Gain variation, -40°C – 85°C, High-Gain HGM = 1 3 dB Mode HGM = 1, including internal T/R switch and external Noise figure, High-Gain Mode 4.8 dB antenna match Input 1-dB compression, High-Gain Mode HGM = 1 –17 dBm Input IP3, High-Gain Mode HGM = 1 –2 dBm Input reflection coefficient, S11 HGM = 1, measured at antenna port –11 dB RF Transmit Gain 22 dB Output power, POUT PIN = 0.5 dBm 20.6 dBm Maximum output power PIN = 5 dBm 22 dBm Power Added Efficiency, PAE PIN = 0.5 dBm 34% Output 1-dB compression 19 dBm Output IP3 32 dBm Output power variation over frequency 2400 – 2483.5 MHz, PIN = 0.5 dBm 0.5 dB Output power variation over power supply 2 V – 3.6 V , PIN = 0.5 dBm 3.5 dB Output power variation over temperature -40°C – 85°C, PIN = 0.5 dBm 1.5 dB PIN = 0.5 dBm. The second harmonic can be reduced Second harmonic power to below regulatory limits by using an external LC filter –15 dBm and antenna. PIN = 0.5 dBm. The third harmonic can be reduced to Third harmonic power below regulatory limits by using an external LC filter –30 dBm and antenna. 4.5 Thermal Resistance Characteristics for RGV Package NAME DESCRIPTION °C/W(1) (2) AIR FLOW (m/s)(3) R ΘJC-top Junction-to-case (top) 52.8 0.00 R ΘJB Junction-to-board 20.4 0.00 R ΘJA Junction-to-free air 41.9 0.00 PsiJT Junction-to-package top 1.4 0.00 PsiJB Junction-to-board 20.5 0.00 R ΘJC-bottom Junction-to-case (bottom) 8.3 0.00 (1) °C/W = degrees Celsius per watt. (2) These values are based on a JEDEC-defined 2S2P system (with the exception of the Theta JC [R ΘJC] value, which is based on a JEDEC-defined 1S0P system) and will change based on environment as well as application. For more information, see these EIA/JEDEC standards: • JESD51-2, Integrated Circuits Thermal Test Method Environmental Conditions - Natural Convection (Still Air) • JESD51-3, Low Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages • JESD51-7, High Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages • JESD51-9, Test Boards for Area Array Surface Mount Package Thermal Measurements (3) m/s = meters per second. Copyright © 2008–2014, Texas Instruments Incorporated Specifications 7 Submit Documentation Feedback Product Folder Links: CC2591 |
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