4

INA181

SBOS793 – APRIL 2017

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Copyright © 2017, Texas Instruments Incorporated

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

(3)

Input voltage at any pin can exceed the voltage shown if the current at that pin is limited to 5 mA.

7 Specifications

7.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)

(1)

MIN

MAX

UNIT

6

V

–26

26

V

GND – 0.3

26

Input voltage range

at REF pin

GND – 0.3

V

Output voltage

GND – 0.3

V

8

mA

–55

150

°C

150

°C

–65

150

°C

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

7.2 ESD Ratings

VALUE

UNIT

Electrostatic discharge

±3000

V

±1000

7.3 Recommended Operating Conditions

MIN

NOM

MAX

UNIT

Common-mode input voltage (IN+ and IN–)

–0.2

12

26

V

Operating supply voltage

2.7

5

5.5

V

Operating free-air temperature

–40

125

°C

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

7.4 Thermal Information

INA181

UNIT

DBV (SOT-23)

6 PINS

Junction-to-ambient thermal resistance

198.7

°C/W

Junction-to-case (top) thermal resistance

120.9

°C/W

Junction-to-board thermal resistance

52.3

°C/W

Junction-to-top characterization parameter

30.3

°C/W

Junction-to-board characterization parameter

52.0

°C/W

Junction-to-case (bottom) thermal resistance

N/A

°C/W