5

bq24715

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SLUSBD1B – MARCH 2013 – REVISED SEPTEMBER 2016

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7.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

MAX

UNIT

Voltage range

SRN, SRP, ACN, ACP, CMSRC, VCC

0

24

V

PHASE

–2

24

V

ACDET, SDA, SCL, LODRV, REGN, IOUT, ACOK, CELL

0

6.5

V

BTST, HIDRV, ACDRV

0

30

V

BATDRV

–0.3

16

V

Maximum

difference range

SRP–SRN, ACP–CAN

–0.2

0.2

V

Junction temperature range

–20

125

°C

Operating free-air temperature range

–20

85

°C

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report (SPRA953).

(2)

The junction-to-board thermal resistance is obtained by simulating in an environment with a ring cold plate fixture to control the PCB

temperature, as described in JESD51-8.

7.4 Thermal Information

bq24715

UNIT

RGR Package

(QFN)

20 PINS

Junction-to-ambient thermal resistance

34.6

°C/W

Junction-to-case (top) thermal resistance

49.3

°C/W

12.5

°C/W

Junction-to-top characterization parameter

0.5

°C/W

Junction-to-board characterization parameter

12.7

°C/W

Junction-to-case (bottom) thermal resistance

1

°C/W