OPAX322-Q1 datasheet(8/39 Pages) TI1

Part #	OPAX322-Q1

Description	20-MHz, Low-Noise, 1.8-V, RRI/O, CMOS Operational Amplifier

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Manufacturer	TI1 [Texas Instruments]

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OPA322-Q1

OPA2322-Q1

OPA4322-Q1

SLOS856B – JUNE 2013 – REVISED MAY 2017

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Product Folder Links: OPA322-Q1 OPA2322-Q1 OPA4322-Q1

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(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

6.4 Thermal Information: OPA322-Q1

THERMAL METRIC(1)

OPA322-Q1

UNIT

DBV (SOT-23)

5 PINS

RθJA

Junction-to-ambient thermal resistance

219.3

°C/W

RθJC(top)

Junction-to-case(top) thermal resistance

107.5

°C/W

RθJB

Junction-to-board thermal resistance

57.5

°C/W

ψJT

Junction-to-top characterization parameter

7.4

°C/W

ψJB

Junction-to-board characterization parameter

56.9

°C/W

RθJC(bot)

Junction-to-case(bottom) thermal resistance

—

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

6.5 Thermal Information: OPA2322-Q1

THERMAL METRIC(1)

OPA2322-Q1

UNIT

DGK (VSSOP)

8 PINS

RθJA

Junction-to-ambient thermal resistance

174.8

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

43.9

°C/W

RθJB

Junction-to-board thermal resistance

95

°C/W

ψJT

Junction-to-top characterization parameter

2

°C/W

ψJB

Junction-to-board characterization parameter

93.5

°C/W

RθJC(bot)

Junction-to-case (bottom) thermal resistance

—

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

6.6 Thermal Information: OPA4322-Q1

THERMAL METRIC(1)

OPA4322-Q1

UNIT

PW (TSSOP)

14 PINS

RθJA

Junction-to-ambient thermal resistance

109.8

°C/W

RθJC(top)

Junction-to-case(top) thermal resistance

34.9

°C/W

RθJB

Junction-to-board thermal resistance

52.5

°C/W

ψJT

Junction-to-top characterization parameter

2.2

°C/W

ψJB

Junction-to-board characterization parameter

51.8

°C/W

RθJC(bot)

Junction-to-case(bottom) thermal resistance

—

°C/W

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