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REF3112-Q1 Datasheet(PDF) 4 Page - Texas Instruments |
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REF3112-Q1 Datasheet(HTML) 4 Page - Texas Instruments |
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4 / 23 page  4 REF3112-Q1, REF3120-Q1, REF3125-Q1 REF3130-Q1, REF3133-Q1, REF3140-Q1 SBVS299 – APRIL 2017 www.ti.com Product Folder Links: REF3112-Q1 REF3120-Q1 REF3125-Q1 REF3130-Q1 REF3133-Q1 REF3140-Q1 Submit Documentation Feedback Copyright © 2017, Texas Instruments Incorporated (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. 7 Specifications 7.1 Absolute Maximum Ratings over operating free-air temperature range (unless otherwise noted) (1) MIN MAX UNIT Supply voltage, V+ to V– 7 V Output short circuit Continuous Operating temperature –55 135 °C Junction temperature 150 °C Storage temperature, Tstg –65 150 °C (1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. (2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. 7.2 ESD Ratings VALUE UNIT V(ESD) Electrostatic discharge Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±2000 V Charged-device model (CDM), per JEDEC specification JESD22-C101(2) ±1000 (1) Minimum supply voltage for the REF3112-Q1 is 1.8 V. 7.3 Recommended Operating Conditions over operating free-air temperature range (unless otherwise noted) MIN MAX UNIT VIN Input voltage VREF + 0.05 (1) 5.5 V ILOAD Load current 25 mA TA Operating temperature –40 125 °C (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report. 7.4 Thermal Information THERMAL METRIC(1) REF31xx-Q1 UNIT DBZ (SOT-23) 3 PINS RθJA Junction-to-ambient thermal resistance 292.9 °C/W RθJC(top) Junction-to-case (top) thermal resistance 124.4 °C/W RθJB Junction-to-board thermal resistance 89 °C/W ψJT Junction-to-top characterization parameter 11.4 °C/W ψJB Junction-to-board characterization parameter 87.6 °C/W RθJC(bot) Junction-to-case (bottom) thermal resistance — °C/W (1) Minimum supply voltage for the REF3112 is 1.8 V. 7.5 Electrical Characteristics at TA = 25°C, ILOAD = 0 mA, and VIN = 5 V (unless otherwise noted) PARAMETER TEST CONDITIONS MIN TYP MAX UNIT REF3312-Q1(1) — 1.25 V VOUT Output voltage 1.2475 1.25 1.2525 V Initial accuracy –0.2% 0.2% Output voltage noise f = 0.1 Hz to 10 Hz 17 μVPP f = 10 Hz to 10 kHz 24 μVRMS |
Similar Part No. - REF3112-Q1 |
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Similar Description - REF3112-Q1 |
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