25M02GVTBIT datasheet(8/68 Pages) WINBOND

Part #	25M02GVTBIT

Description	3V 2G-BIT (2 x 1G-BIT) SERIAL SLC NAND FLASH MEMORY WITH DUAL/QUAD SPI BUFFER READ & CONTINUOUS READ CONCURRENT OPERATIONS

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Manufacturer	WINBOND [Winbond]

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W25M02GV

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3. PACKAGE TYPES AND PIN CONFIGURATIONS

W25M02GV is offered in an 8-pad WSON 8x6-mm (package code ZE), and two 24-ball 8x6-mm TFBGA

(package code TB & TC) packages as shown in Figure 1a-b respectively. Package diagrams and

dimensions are illustrated at the end of this datasheet.

3.1 Pad Configuration WSON 8x6-mm

1

2

3

4

/CS

DO (IO

1)

/WP (IO

2)

GND

VCC

/HOLD (IO

3)

DI (IO

0)

CLK

Top View

8

7

6

5

Figure 1a. W25M02GV Pad Assignments, 8-pad WSON 8x6-mm (Package Code ZE)

3.2 Pad Description WSON 8x6-mm

PAD NO.

PAD NAME

I/O

FUNCTION

1

/CS

I

Chip Select Input

2

DO (IO1)

I/O

Data Output (Data Input Output 1)(1)

3

/WP (IO2)

I/O

Write Protect Input ( Data Input Output 2)(2)

4

GND

Ground

5

DI (IO0)

I/O

Data Input (Data Input Output 0)(1)

6

CLK

I

Serial Clock Input

7

/HOLD (IO3)

I/O

Hold Input (Data Input Output 3)(2)

8

VCC

Power Supply

Notes:

1. IO0 and IO1 are used for Standard and Dual SPI instructions

2. IO0 – IO3 are used for Quad SPI instructions, /WP & /HOLD functions are only available for Standard/Dual SPI.

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