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W25Q16DWUUIG Datasheet(PDF) 2 Page - Winbond |
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W25Q16DWUUIG Datasheet(HTML) 2 Page - Winbond |
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2 / 84 page  W25Q16DW - 2 - Table of Contents 1. GENERAL DESCRIPTION ............................................................................................................... 5 2. FEATURES....................................................................................................................................... 5 3. PACKAGE TYPES AND PIN CONFIGURATIONS .......................................................................... 6 3.1 Pin Configuration SOIC 150 / 208-mil .................................................................................. 6 3.2 Pad Configuration WSON 6x5-mm, USON 4x3-mm............................................................ 6 3.3 Pin Description SOIC 150 / 208-mil, WSON 6x5-mm, USON 4x3-mm ............................... 6 3.4 Ball Configuration WLCSP ................................................................................................... 7 3.5 Ball Description WLCSP....................................................................................................... 7 3.6 Pin Configuration SOIC16 300-mil ....................................................................................... 8 3.7 Pin Description SOIC16 300-mil........................................................................................... 8 4. PIN DESCRIPTIONS........................................................................................................................ 9 4.1 Chip Select (/CS).................................................................................................................. 9 4.2 Serial Data Input, Output and IOs (DI, DO and IO0, IO1, IO2, IO3) .................................... 9 4.3 Write Protect (/WP)............................................................................................................... 9 4.4 HOLD (/HOLD) ..................................................................................................................... 9 4.5 Serial Clock (CLK) ................................................................................................................ 9 5. BLOCK DIAGRAM .......................................................................................................................... 10 6. FUNCTIONAL DESCRIPTION ....................................................................................................... 11 6.1 SPI/QPI OPERATIONS ...................................................................................................... 11 6.1.1 Standard SPI Instructions .....................................................................................................11 6.1.2 Dual SPI Instructions ............................................................................................................11 6.1.3 Quad SPI Instructions ...........................................................................................................12 6.1.4 QPI Instructions ....................................................................................................................12 6.1.5 Hold Function........................................................................................................................12 6.2 WRITE PROTECTION ....................................................................................................... 13 6.2.1 Write Protect Features ..........................................................................................................13 7. STATUS REGISTERS AND INSTRUCTIONS ............................................................................... 14 7.1 STATUS REGISTERS........................................................................................................ 14 7.1.1 BUSY ....................................................................................................................................14 7.1.2 Write Enable Latch (WEL) ....................................................................................................14 7.1.3 Block Protect Bits (BP2, BP1, BP0) ......................................................................................14 7.1.4 Top/Bottom Block Protect (TB) .............................................................................................14 7.1.5 Sector/Block Protect (SEC)...................................................................................................14 7.1.6 Complement Protect (CMP)..................................................................................................14 7.1.7 Status Register Protect (SRP1, SRP0) .................................................................................15 7.1.8 Erase/Program Suspend Status (SUS).................................................................................15 7.1.9 Security Register Lock Bits (LB3, LB2, LB1, LB0) ................................................................15 7.1.10 Quad Enable (QE) ..............................................................................................................15 |
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