W25Q32JVSFIQ datasheet(8/76 Pages) WINBOND

Part #	W25Q32JVSFIQ

Description	3V 32M-BIT SERIAL FLASH MEMORY WITH DUAL, QUAD SPI

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Manufacturer	WINBOND [Winbond]

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W25Q32JV

- 7 -

3.6

Ball Configuration TFBGA 8x6-mm (6x4 Ball Array)

Figure 1d. W25Q32JV Ball Assignments, 24-ball TFBGA 8x6-mm (Package Code TC)

3.7

Ball Description TFBGA 8x6-mm

BALL NO.

PIN NAME

I/O

FUNCTION

A4

/RESET

I

Reset Input(3)

B2

CLK

I

Serial Clock Input

B3

GND

Ground

B4

VCC

Power Supply

C2

/CS

I

Chip Select Input

C4

IO2

I/O

Data Input Output 2(2)

D2

DO (IO1)

I/O

Data Output (Data Input Output 1)(1)

D3

DI (IO0)

I/O

Data Input (Data Input Output 0)(1)

D4

IO3

I/O

Data Input Output 3(2)

Multiple

NC

No Connect

Notes:

1. IO0 and IO1 are used for Standard and Dual SPI instructions

2. IO0

– IO3 are used for Quad SPI instructions.

3. The /RESET pin is a dedicated hardware reset pin regardless of device settings or operation states.

If the hardware reset function is not used, this pin can be left floating or connected to VCC in the system

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W25Q32JVSFIQ Datasheet(PDF) 8 Page - Winbond

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