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W25Q32JVTBIQ Datasheet(PDF) 4 Page - Winbond

Part # W25Q32JVTBIQ
Description  3V 32M-BIT SERIAL FLASH MEMORY WITH DUAL, QUAD SPI
Download  76 Pages
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Manufacturer  WINBOND [Winbond]
Direct Link  http://www.winbond.com
Logo WINBOND - Winbond

W25Q32JVTBIQ Datasheet(HTML) 4 Page - Winbond

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W25Q32JV
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9.
ELECTRICAL CHARACTERISTICS............................................................................................... 58
9.1
Absolute Maximum Ratings (1) .......................................................................................... 58
9.2
Operating Ranges .............................................................................................................. 58
9.3
Power-Up Power-Down Timing and Requirements ........................................................... 59
9.4
DC Electrical Characteristics-............................................................................................. 60
9.5
AC Measurement Conditions ............................................................................................. 61
9.6
AC Electrical Characteristics(6) ........................................................................................... 62
9.7
Serial Output Timing........................................................................................................... 64
9.8
Serial Input Timing.............................................................................................................. 64
10.
PACKAGE SPECIFICATIONS ....................................................................................................... 65
10.1
8-Pin SOIC 208-mil (Package Code SS)............................................................................ 65
10.2
8-Pin VSOP 208-mil (Package Code ST)........................................................................... 66
10.3
8-Pad WSON 6x5-mm (Package Code ZP) ....................................................................... 67
10.4
Pad XSON 4x4x0.45-mm (Package Code XG).................................................................. 68
10.5
16-Pin SOIC 300-mil (Package Code SF).......................................................................... 69
10.6
8-Pin PDIP 300-mil (Package Code DA)............................................................................ 70
10.8
24-Ball TFBGA 8x6-mm (Package Code TC, 6x4 ball array)............................................. 71
11.
ORDERING INFORMATION .......................................................................................................... 73
11.1
Valid Part Numbers and Top Side Marking ........................................................................ 74
12.
REVISION HISTORY...................................................................................................................... 75


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