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CC1150RGVR Datasheet(PDF) 10 Page - Texas Instruments |
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CC1150RGVR Datasheet(HTML) 10 Page - Texas Instruments |
10 / 67 page CC1150 SWRS037B – JANUARY 2006 – REVISED MARCH 2015 www.ti.com 4.11 Power-On Reset For proper Power-On-Reset functionality, the power supply must comply with the requirements in this table. Otherwise, the chip should be assumed to have unknown state until transmitting an SRES strobe over the SPI interface. See Section 5.11.1 for a description of the recommended start-up sequence after turning power on. PARAMETER MIN TYP MAX UNIT CONDITION Power up ramp-up time 5 ms From 0 V until reaching 1.8 V Minimum time between power on and Power-off time 1 ms power off 4.12 Thermal Resistance Characteristics for VQFNP Package NAME DESCRIPTION °C/W(1) (2) RθJC(top) Junction-to-case (top) 54.0 RθJB Junction-to-board 25.1 RθJA Junction-to-free air 48.3 PsiJT Junction-to-package top 1.6 PsiJB Junction-to-board 25.2 RθJC(bottom) Junction-to-case (bottom) 6.3 (1) °C/W = degrees Celsius per watt. (2) These values are based on a JEDEC-defined 2S2P system (with the exception of the Theta JC [RθJC] value, which is based on a JEDEC-defined 1S0P system) and will change based on environment as well as application. For more information, see these EIA/JEDEC standards: • JESD51-2, Integrated Circuits Thermal Test Method Environmental Conditions - Natural Convection (Still Air) • JESD51-3, Low Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages • JESD51-7, High Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages • JESD51-9, Test Boards for Area Array Surface Mount Package Thermal Measurements Power dissipation of 2 W and an ambient temperature of 70ºC is assumed. 10 Specifications Copyright © 2006–2015, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: CC1150 |
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