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CB018B0332 Datasheet(PDF) 5 Page - AVX Corporation |
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CB018B0332 Datasheet(HTML) 5 Page - AVX Corporation |
5 / 8 page 43 Film Chip Capacitors PPS DIELECTRIC – CB Series MOUNTING AND SOLDERING RECOMMENDATIONS RECOMMENDED SOLDER PASTE THICKNESS For optimum solderability, the recommended soldering paste thickness: 1206 to 1812 :150 to 200μm In case of hand soldering, the temperature of the soldering iron should not be above 250°C. Special care must be taken to avoid touching the capacitor body with the iron tip. RECOMMENDED CLEANING To clean flux from the PC board assembly, the recommended products are: ethanol, isopropyl alcohol, and deionized water wash. The cleaning products to avoid are: Toluene, Xylene, Trichloroethylene, Terpene Cleaner EC-7, surface active agent. In case of using another solvent, please contact us. OTHER CAUTIONS Flame retardancy: the dielectric film is not a flame retardant material. Environment: contact us when chips are used in humid or gas atmosphere and /or when using resin. Recommended handling: do not use edged tools, so not to damage the capacitors. TIN WHISKERS TESTS : JEDEC STANDARD NO 22A121 Stress Type Ref. Spec. Test Conditions Analysis Results Temperature cycling JESD22-A104 -55°C +85(+10/-0)°C air SEM x 1000 Pass 5 to 10 minutes soak 3 cycles/hour Ambient Temperature / 30+/-2°C - 60+/-3% RH -2000H SEM x 1000 Pass Humidity Storage High Temperature / 70+/-5°C - 93+3/-2% RH -1000H SEM x 1000 Pass Humidity Storage Size Code Case Size A B C 01 1206 1.30 (0.051) 1.30 (0.051) 2.20 (0.087) 02 1210 2.00 (0.079) 1.30 (0.051) 2.20 (0.087) 03 1812 3.00 (0.118) 1.50 (0.059) 3.50 (0.137) PAD DIMENSIONS: millimeters (inches) A CB *Reflow soldering referring to JEDEC Standard with some limitations *JEDEC J-Std 020C SOLDERING PROFILE The capacitors can be mounted using infrared and vapor phase soldering following recommended below. They are NOT suitable for wave soldering. All temperature refer to topside of the package, measured on the package body surface. Profile Feature 1206 to 1812 Ramp-Up (Ts max to Tp) 3°C / second max Preheat - Temperature Min (Ts min) 150°C - Temperature Min (Ts max) 200°C - Time (ts min to ts max) 180 sec. max Time maintained above - Temperature (TL) 217°C - Time (tL) 90 sec. max Peak temperature (Tp) 260°C Time within 5°C of peak 10 sec. temperature (tp) Ramp-Down 6°C / sec. 030 Time (seconds) 60 90 120 150 180 210 240 Ramp down Ramp up 270 300 330 Tp Tp - 5ºC Ts min Ts max TL tS tp tL |
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