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ADG918BCP Datasheet(PDF) 3 Page - Analog Devices |
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ADG918BCP Datasheet(HTML) 3 Page - Analog Devices |
3 / 4 page ADG918/ADG919 –3– REV. PrC PRELIMINARY TECHNICAL DATA ABSOLUTE MAXIMUM RATINGS 1 (TA = +25°C unless otherwise noted) VDD to GND -0.5 V to +4 V Inputs to GND -0.5 V to VDD + 0.3V Input Power TBD dBm Operating Temperature Range Industrial (B Version) –40°C to +85°C Storage Temperature Range –65°C to +150°C Junction Temperature +150°C MSOP Package θ JA Thermal Impedance 206°C/W CSP Package θ JA Thermal Impedance TBD°C/W Lead Temperature, Soldering (10seconds) 300°C IR Reflow, Peak Temperature (<20 seconds) +235°C NOTES 1Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or any other conditions above those listed in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Only one absolute maximum rating may be applied at any one time. CAUTION ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on the human body and test equipment and can discharge without detection. Although the ADG919 features proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance degradation or loss of functionality. ORDERING GUIDE Model Temperature Range Package Descriptions Branding Package Options ADG918BRM –40°C to +85°C MSOP (Micro Small Outline Package) RM-8 ADG918BCP –40°C to +85°C Chip Scale Package CP-8 ADG919BRM –40°C to +85°C MSOP (Micro Small Outline Package) RM-8 ADG919BCP –40°C to +85°C Chip Scale Package CP-8 PIN CONFIGURATION 8-Lead MSOP (RM-8) 3x3mm CSP (CP-8) TOP VIEW (Not to Scale) 8 7 6 5 1 2 3 4 VDD CONTROL GND RFCommon ADG918/ ADG919 GND GND RF1 RF2 |
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