BIAS

IN

EN

GND

OUT

C3

B2

A3

C1

A1

IN

GND

BIAS

6

5

4

OUT

NC

EN

1

2

3

Thermal

Pad

(1)

TPS720

www.ti.com

SBVS100E – JUNE 2008 – REVISED SEPTEMBER 2015

5 Pin Configuration and Functions

DRV Package

YZU Package

6-Pin SON With Exposed Thermal Pad

5-Pin DSBGA

Top View

Top View

(1)

TI recommends connecting the SON (DRV)

package thermal pad to ground.

Pin Functions

PIN

I/O

DESCRIPTION

NAME

DRV

YZU

Output pin. A 2.2-

μF ceramic capacitor is connected from this pin to ground, for stability and to provide

OUT

1

A3

O

load transients. See Input and Output Capacitor Requirements.

NC

2

—

—

No connection.

Enable pin. A logic high signal on this pin turns the device on and regulates the voltage from IN to

EN

3

C3

I

OUT. A logic low on this pin turns off the device.

Bias supply pin. TI recommends bypassing this input with a ceramic capacitor to ground for better

BIAS

4

C1

I

transient performance. See Input and Output Capacitor Requirements.

GND

5

B2

—

Ground pin.

IN

6

A1

I

ceramic capacitor to ground. See Input and Output Capacitor Requirements.

6 Specifications

6.1 Absolute Maximum Ratings

(1)

MIN

MAX

UNIT

(2)

Input voltage (steady-state)

–0.3

(3)

V

(4)

Peak transient input

5.5

V

Bias voltage

–0.3

6

V

Enable voltage

–0.3

6

V

Output voltage

–0.3

5

V

Peak output current

Internally limited

Output short circuit duration

Indefinite

Total continuous power dissipation

See Thermal Information

Operating junction temperature

–55

125

°C

Storage temperature

–55

150

°C

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

(3)

Whichever is less.

(4)

For durations no longer than 1ms each, for a total of no more than 1000 occurrences over the lifetime of the device.

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