TPS92210

SLUS989B – JANUARY 2010 – REVISED SEPTEMBER 2012

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This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with

appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more

susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.

ORDERING INFORMATION

OPERATING

ORDERABLE

TEMPERATURE

PACKAGE

PINS

TRANSPORT MEDIA

QUANTITY

DEVICE NUMBER

TPS92210DR

Tape and Reel

2500

–40°C to 125°C

SOIC

8

TPS92210D

Tube

75

ABSOLUTE MAXIMUM RATINGS

(1)

terminal (unless otherwise noted)

VALUE

UNIT

MIN

MAX

VDD

–0.5

25

DRN, during conduction

–0.5

2.0

DRN, during non-conduction

20

Input voltage range

–0.5

16

V

–0.5

7

–0.5

1.0

VDD – VCG

–7

10

Continuous input current

(2)

10

mA

Input current range

(3)

–3

1

DRN

-4

A

Output current

DRN, pulsed 200ns, 2% duty cycle

–6

1.5

Operating junction temperature

–40

150

°C

Storage temperature range

–65

150

°C

Lead temperature

Soldering, 10 s

260

°C

(1)

These are stress ratings only. Stress beyond these limits may cause permanent damage to the device. Functional operation of the

device at these or any conditions beyond those indicated under Recommended Operating Conditions is not implied. Exposure to

absolute maximum rated conditions for extended periods of time may affect device reliability

(2)

Voltage on VCG is internally clamped. The clamp level varies with operating conditions. In normal use, VCG is current fed with the

voltage internally limited

(3)

In normal use, pins OTM, PCL, TZE, and FB are connected to resistors to GND and internally limited in voltage swing

2

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