Electronic Components Datasheet Search |
|
UCC20225NPLR Datasheet(PDF) 7 Page - Texas Instruments |
|
|
UCC20225NPLR Datasheet(HTML) 7 Page - Texas Instruments |
7 / 44 page 7 UCC20225 www.ti.com SLUSCV8 – APRIL 2017 Product Folder Links: UCC20225 Submit Documentation Feedback Copyright © 2017, Texas Instruments Incorporated 6.7 Safety-Related Certifications VDE CSA UL CQC Certified according to DIN V VDE V 0884-10 (VDE V 0884-10):2006-12 and DIN EN 61010-1 (VDE 0411- 1):2011-07 Approved under CSA Component Acceptance Notice 5A, IEC 60950-1, and IEC 61010-1 Certified according to UL 1577 Component Recognition Program Certified according to GB4943.1-2011 Basic Insulation Maximum Transient Overvoltage, 3535 VPK; Maximum Repetitive Peak Voltage, 792 VPK; Maximum Surge Isolation Voltage, 3535 VPK Basic insulation and Reinforced insulation per CSA 60950-1- 07+A1+A2 and IEC 60950-1 2nd Ed.+A1+A2;Basic insulation per CSA 61010-1-12 and IEC 61010-1 3rd Ed. Single protection, 2500 VRMS Basic Insulation, Altitude ≤ 5000 m, Tropical Climate, Agency Qualification Planned Agency Qualification Planned Agency Qualification Planned Agency Qualification Planned 6.8 Safety-Limiting Values Safety limiting intends to prevent potential damage to the isolation barrier upon failure of input or output circuitry. A failure of the I/O can allow low resistance to ground or the supply and, without current limiting, dissipate sufficient power to overheat the die and damage the isolation barrier potentially leading to secondary system failures. PARAMETER TEST CONDITIONS SIDE MIN TYP MAX UNIT IS Safety output supply current RθJA = 98.0ºC/W, VDDA/B = 12 V, TA = 25°C, TJ = 150°C See Figure 2 DRIVER A, DRIVER B 50 mA RθJA = 98.0ºC/W, VDDA/B = 25 V, TA = 25°C, TJ = 150°C DRIVER A, DRIVER B 24 mA PS Safety supply power RθJA = 98.0ºC/W, TA = 25°C, TJ = 150°C See Figure 3 INPUT 0.05 W DRIVER A 0.60 DRIVER B 0.60 TOTAL 1.25 TS Safety temperature 150 °C The safety-limiting constraint is the maximum junction temperature specified in the datasheet. The power dissipation and junction-to-air thermal impedance of the device installed in the application hardware determines the junction temperature. The assumed junction-to-air thermal resistance in the Thermal Information table is that of a device installed on a high-K test board for leaded surface-mount packages. The power is the recommended maximum input voltage times the current. The junction temperature is then the ambient temperature plus the power times the junction-to-air thermal resistance. More detailed information about junction temperature prediction can be found in Estimating Junction Temperature |
Similar Part No. - UCC20225NPLR |
|
Similar Description - UCC20225NPLR |
|
|
Link URL |
Privacy Policy |
ALLDATASHEET.NET |
Does ALLDATASHEET help your business so far? [ DONATE ] |
About Alldatasheet | Advertisement | Contact us | Privacy Policy | Link Exchange | Manufacturer List All Rights Reserved©Alldatasheet.com |
Russian : Alldatasheetru.com | Korean : Alldatasheet.co.kr | Spanish : Alldatasheet.es | French : Alldatasheet.fr | Italian : Alldatasheetit.com Portuguese : Alldatasheetpt.com | Polish : Alldatasheet.pl | Vietnamese : Alldatasheet.vn Indian : Alldatasheet.in | Mexican : Alldatasheet.com.mx | British : Alldatasheet.co.uk | New Zealand : Alldatasheet.co.nz |
Family Site : ic2ic.com |
icmetro.com |