HMPP-389x Series

MiniPak Surface Mount RF PIN Switch Diodes

Data Sheet

Description/Applications

These ultra-miniature products represent the blending of

AvagoTechnologies’proven semiconductor and the latest

in leadless packaging technology.

TheHMPP-389xseriesisoptimizedforswitchingapplications

where low resistance at low current and low capacitance

are required.The MiniPak package offers reduced parasitics

when compared to conventional leaded diodes, and lower

thermal resistance.

Low junction capacitance of the PIN diode chip, combined

with ultra low package parasitics, mean that these prod-

ucts may be used at frequencies which are higher than

the upper limit for conventional PIN diodes.

Note that Avago’s manufacturing techniques assure that

dice packaged in pairs are taken from adjacent sites on

the wafer, assuring the highest degree of match.

The HMPP-389T low inductance wide band shunt switch

is well suited for applications up to 6 GHz.

Minipak 1412 is a ceramic based package, while Minipak

QFN is a leadframe based package.

Package Lead Code Identification (Top View)

Features

• Surface mount MiniPak package

• Better thermal conductivity for higher power dissipa-

tion

• Single and dual versions

• Matched diodes for consistent performance

• Low capacitance

• Low resistance at low current

• Low FIT (Failure in Time) rate*

• Six-sigma quality level

* For more information, see the Surface Mount Schottky Reliability

Data Sheet.

Pin Connections and Package Marking

Notes:

1. Package marking provides orientation and

identification.

2. See “Electrical Specifications” for appropri-

ate package marking.

3

2

Product code

Date code

4

AA

1

Single

3

2

4

1

#0

Anti-parallel

3

2

4

1

#2

Parallel

3

2

4

1

#5

(Minipak 1412)

(Minipak 1412)

(Minipak 1412)

Shunt Switch

3

2

4

1

T

Anode

Cathode

Cathode

Anode