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HPA02246QRTERQ1 Datasheet(PDF) 3 Page - Texas Instruments

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Part # HPA02246QRTERQ1
Description  2.95-V to 6-V Input, 6-A Output, 2-MHz, Synchronous Step-Down SWIFT Switcher
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Manufacturer  TI1 [Texas Instruments]
Direct Link  http://www.ti.com
Logo TI1 - Texas Instruments

HPA02246QRTERQ1 Datasheet(HTML) 3 Page - Texas Instruments

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VIN
GND
GND
PH
PH
SS/TR
PH
1
4
3
2
16
15
14
13
12
9
10
11
5
6
7
8
Thermal
Pad
VIN
TPS54618-Q1
www.ti.com
SLVSBY9D – AUGUST 2013 – REVISED JANUARY 2016
5 Pin Configuration and Functions
RTE Package
16-Pin WQFN With Exposed Thermal Pad
Top View
Pin Functions
PIN
TYPE(1)
DESCRIPTION
NAME
NO.
AGND
5
G
Analog ground should be electrically connected to GND close to the device.
A bootstrap capacitor is required between BOOT and PH. If the voltage on this capacitor is below the
BOOT
13
I
minimum required by the BOOT UVLO, the output is forced to switch off until the capacitor is refreshed.
Error amplifier output, and input to the output switch current comparator. Connect frequency
COMP
7
O
compensation components to this pin.
Enable pin, internal pullup current source. Pull below 1.2 V to disable. Float to enable. Can be used to
EN
15
I
set the on/off threshold (adjust UVLO) with two additional resistors.
3
GND
G
Power ground. This pin should be electrically connected directly to the power pad under the device.
4
10
The source of the internal high-side power MOSFET, and drain of the internal low-side (synchronous)
PH
11
O
rectifier MOSFET.
12
An open-drain output, asserts low if output voltage is low due to thermal shutdown, overcurrent,
PWRGD
14
O
over/undervoltage or EN shut down.
RT/CLK
8
I/O
Resistor timing or external clock input pin
Slow-start and tracking. An external capacitor connected to this pin sets the output voltage rise time.
SS/TR
9
I/O
This pin can also be used for tracking.
1
VIN
2
I
Input supply voltage, 2.95 V to 6 V
16
VSENSE
6
I
Inverting node of the transconductance (gm) error amplifier
Thermal
GND pin should be connected to the exposed power pad for proper operation. This power pad should
G
Pad
be connected to any internal PCB ground plane using multiple vias for good thermal performance.
(1)
I = Input, O = Output, G = Ground
Copyright © 2013–2016, Texas Instruments Incorporated
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Product Folder Links: TPS54618-Q1


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