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TPS79801QDGNRQ1 Datasheet(PDF) 3 Page - Texas Instruments |
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TPS79801QDGNRQ1 Datasheet(HTML) 3 Page - Texas Instruments |
3 / 25 page 2 1 3 4 7 8 6 5 SENSE/FB NC GND OUT EN NC NC IN TPS79801-Q1, TPS79850-Q1 www.ti.com SLVS822E – MARCH 2009 – REVISED SEPTEMBER 2015 5 Pin Configuration and Functions DGN Package 8-Pin MSOP With PowerPAD™ Top View The exposed thermal pad is connected to ground through pin 4 (GND). Pin Functions PIN I/O DESCRIPTION NAME NO. Enable pin. Driving the EN pin high turns on the regulator over full operating range. Driving this pin EN 5 I low puts the regulator into shutdown mode over full operating range. Input pin. TI recommends a 0.1- μF ceramic or greater capacitor from this pin to ground to assure IN 8 I stability. Both input and output capacitor grounds should be tied back to the IC ground with no significant impedance between them. GND 4 O Ground. The exposed thermal pad is connected to ground through this pin. Regulated output voltage pin. A small (1 μF) capacitor is needed from this pin to ground to assure OUT 1 O stability. This pin is the input to the control loop error amplifier; it is used to set the output voltage of the SENSE/FB 2 I device. NC 3, 6, 7 — No internal connection 6 Specifications 6.1 Absolute Maximum Ratings over operating free-air temperature range (unless otherwise noted) (1) MIN MAX UNIT IN(2) –65 60 V OUT –0.3 28 V VIN Input voltage range FB –0.3 7 V EN(2) –65 60 V Enable to IN differential 0.6 VIN V TJ Junction temperature range(3) –40 125 °C Tstg Storage temperature –65 150 °C (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) Transient: 500 ms for VIN > 50 V (3) The junction temperature must not exceed 125ºC. See Figure 1 to determine the maximum ambient operating temperature versus the supply voltage and load current. The safe operating area curves assume a 50ºC/W thermal impedance and may need to be adjusted to match actual system thermal performance. 6.2 ESD Ratings VALUE UNIT Human body model (HBM), per AEC Q100-002(1) ±2000 V(ESD) Electrostatic discharge V Charged device model (CDM), per AEC Q100-011 ±1000 (1) AEC Q100-002 indicates HBM stressing is done in accordance with the ANSI/ESDA/JEDEC JS-001 specification. Copyright © 2009–2015, Texas Instruments Incorporated Submit Documentation Feedback 3 Product Folder Links: TPS79801-Q1 TPS79850-Q1 |
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