2

1

3

4

7

8

6

5

SENSE/FB

NC

GND

OUT

EN

NC

NC

IN

TPS79801-Q1, TPS79850-Q1

www.ti.com

SLVS822E – MARCH 2009 – REVISED SEPTEMBER 2015

5 Pin Configuration and Functions

DGN Package

8-Pin MSOP With PowerPAD™

Top View

The exposed thermal pad is connected to ground through pin 4 (GND).

Pin Functions

PIN

I/O

DESCRIPTION

NAME

NO.

Enable pin. Driving the EN pin high turns on the regulator over full operating range. Driving this pin

EN

5

I

low puts the regulator into shutdown mode over full operating range.

Input pin. TI recommends a 0.1-

μF ceramic or greater capacitor from this pin to ground to assure

IN

8

I

stability. Both input and output capacitor grounds should be tied back to the IC ground with no

significant impedance between them.

GND

4

O

Ground. The exposed thermal pad is connected to ground through this pin.

Regulated output voltage pin. A small (1

μF) capacitor is needed from this pin to ground to assure

OUT

1

O

stability.

This pin is the input to the control loop error amplifier; it is used to set the output voltage of the

SENSE/FB

2

I

device.

NC

3, 6, 7

—

No internal connection

6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)

(1)

MIN

MAX

UNIT

–65

60

V

OUT

–0.3

28

V

Input voltage range

FB

–0.3

7

V

–65

60

V

Enable to IN differential

0.6

V

–40

125

°C

–65

150

°C

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

(3)

The junction temperature must not exceed 125ºC. See Figure 1 to determine the maximum ambient operating temperature versus the

supply voltage and load current. The safe operating area curves assume a 50ºC/W thermal impedance and may need to be adjusted to

match actual system thermal performance.

6.2 ESD Ratings

VALUE

UNIT

±2000

Electrostatic discharge

V

Charged device model (CDM), per AEC Q100-011

±1000

(1)

AEC Q100-002 indicates HBM stressing is done in accordance with the ANSI/ESDA/JEDEC JS-001 specification.

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