S1

VDD

SCL

SDA

I2C_ADDR_SEL

MICp

MICn / HP_REF

SLEEVE_SENSE

RING2_SENSE

SLEEVE

RING2

GND

Control

Logic

TS3A225E

FET2

FET1

TIP

RING1

MIC_BIAS

MICI

MIC_REF

R1

C1

C2

C3

/MIC_PRESENT

DET_TRIGGER

TIP_SENSE

TS3A225E

www.ti.com

SCDS329A – AUGUST 2012 – REVISED MAY 2013

AUTONOMOUS AUDIO HEADSET SWITCH

Check for Samples: TS3A225E

1

FEATURES

APPLICATIONS

•

•

Mobile Phones/ Tablet PCs

•

Break Before Make Stereo Jack Switches

•

Notebook Computers

•

Ron for Ground FET Switches

DESCRIPTION

–

WCSP Package: 70 m

Ω

The TS3A225E is an audio headset switch device.

–

QFN Package: 100 m

Ω

The device detects the presence of an analog

•

Autonomous Detection of GND and MIC

microphone

and

switches

a

system

analog

Connections

microphone pin between different connectors in an

audio stereo jack. The microphone connection in a

•

stereo connector can be swapped with the ground

Pin

connection depending on manufacturer. When the

•

HDA Compatible MIC Present Indicator

TS3A225E detects a certain configuration, the device

•

automatically connects the microphone line to the

appropriate pin. The device also reports the presence

•

ESD Performance Tested Per JESD 22:

of an analog microphone on an audio stereo jack.

–

2000-V Human-Body Model (A114-B, Class

In some systems, it is desirable to connect the stereo

II)

jack pin to ground. The TS3A225E provides two

–

500-V Charged-Device Model (C101)

internal low resistance (<100m

Ω) FET switches for

•

ESD Performance (SLEEVE, RING2, TIP)

ground shorting.

–

±8-kV Contact Discharge (IEC 61000-4-2)

ORDERING INFORMATION

ORDERABLE PART NUMBER

TOP-SIDE MARKING

RTE - QFN

Tape and reel

TS3A225ERTER

ZTL

–40°C to 85°C

YFF - WCSP

Tape and reel

TS3A225EYFFR

YP225E

(1)

Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.

(2)

For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI

Web site at www.ti.com.

1

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of

Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

PRODUCTION DATA information is current as of publication date.

Copyright © 2012–2013, Texas Instruments Incorporated

Products conform to specifications per the terms of the Texas

Instruments standard warranty. Production processing does not

necessarily include testing of all parameters.