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842023 Datasheet(PDF) 10 Page - Integrated Device Technology |
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842023 Datasheet(HTML) 10 Page - Integrated Device Technology |
10 / 15 page FEMTOCLOCK™ CRYSTAL-TO-HSTL CLOCK GENERATOR 10 Rev A 8/14/15 842023 DATA SHEET Power Considerations This section provides information on power dissipation and junction temperature for the 842023. Equations and example calculations are also provided. 1. Power Dissipation. The total power dissipation for the 842023 is the sum of the core power plus the power dissipated in the load(s). The following is the power dissipation for VDD= 3.3V + 5% = 3.465V, which gives worst case results. NOTE: Please refer to Section 3 for details on calculating power dissipated in the load. • Power (core)MAX = VDD_MAX * (IDD_MAX + IDDA_MAX) = 3.465V * (84mA + 11mA) = 329.18mW • Power (outputs)MAX = 94.32mW/Loaded Output pair Total Power_MAX (3.465V, with all outputs switching) = 329.18mW + 94.32mW = 423.49mW 2. Junction Temperature. Junction temperature, Tj, is the temperature at the junction of the bond wire and bond pad and directly affects the reliability of the device. The maximum recommended junction temperature is 125°C. The equation for Tj is as follows: Tj = JA * Pd_total + TA Tj = Junction Temperature JA = Junction-to-Ambient Thermal Resistance Pd_total = Total Device Power Dissipation (example calculation is in section 1 above) TA = Ambient Temperature In order to calculate junction temperature, the appropriate junction-to-ambient thermal resistance JA must be used. Assuming no air flow and a multi-layer board, the appropriate value is 129.5°C/W per Table 7 below. Therefore, Tj for an ambient temperature of 70°C with all outputs switching is: 70°C + 0.423W * 129.5°C/W = 124.8°C. This is below the limit of 125°C. This calculation is only an example. Tj will obviously vary depending on the number of loaded outputs, supply voltage, air flow and the type of board (multi-layer). Table 7. Thermal Resistance JA for 8 Lead TSSOP, Forced Convection JA vs. Air Flow Meters per Second 01 2.5 Multi-Layer PCB, JEDEC Standard Test Boards 129.5°C/W 125.5°C/W 123.5°C/W |
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