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EL5825ILZ-T13 Datasheet(PDF) 5 Page - Intersil Corporation |
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EL5825ILZ-T13 Datasheet(HTML) 5 Page - Intersil Corporation |
5 / 12 page 5 FN7005.4 June 24, 2005 FIGURE 7. SMALL SIGNAL RESPONSE (FALLING FROM 200mV TO 100mV) FIGURE 8. PACKAGE POWER DISSIPATION vs AMBIENT TEMPERATURE FIGURE 9. PACKAGE POWER DISSIPATION vs AMBIENT TEMPERATURE FIGURE 10. PACKAGE POWER DISSIPATION vs AMBIENT TEMPERATURE FIGURE 11. PACKAGE POWER DISSIPATION vs AMBIENT TEMPERATURE Typical Performance Curves (Continued) SCLK SDA ENA OUTA M=200µs/div 1.4 0 AMBIENT TEMPERATURE (°C) 1.2 1 0.8 0.6 0.4 0.2 0 25 50 75 100 125 85 1.176W θ JA = 85 °C /W TS SO P2 4 JEDEC JESD51-7 HIGH EFFECTIVE THERMAL CONDUCTIVITY TEST BOARD 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 0 255075 100 125 AMBIENT TEMPERATURE (°C) 85 781mW θ JA = 12 8°C/ W TS SO P2 4 JEDEC JESD51-3 LOW EFFECTIVE THERMAL CONDUCTIVITY TEST BOARD JEDEC JESD51-7 HIGH EFFECTIVE THERMAL CONDUCTIVITY TEST BOARD - QFN EXPOSED DIEPAD SOLDERED TO PCB PER JESD51-5 3 2.5 2 1.5 1 0.5 0 0 255075 100 150 AMBIENT TEMPERATURE (°C) 2.703W θ JA = 37 °C /W Q FN 24 125 85 JEDEC JESD51-3 AND SEMI G42-88 (SINGLE LAYER) TEST BOARD 0.8 0.7 0.5 0.3 0.2 0.1 0 025 50 75 100 150 AMBIENT TEMPERATURE (°C) 714mW 125 85 0.6 0.4 EL5825 |
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