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Data subject to change. Copyright © 2005-2012 Avago Technologies. All rights reserved. Obsoletes 5989-4778EN

AV02-3802EN - September 12, 2012

Assembly and Handling Procedures for PIN Chips

1. Storage

Devices should be stored in a dry nitrogen purged des-

sicator or equivalent.

2. Cleaning

If required, surface contamination may be removed

with electronic grade solvents. Typical solvents, such

as freon (T.F. or T.M.C.), acetone, deionized water, and

methanol, or their locally approved equivalents, can

be used singularly or in combinations. Typical cleaning

times per solvent are one to three minutes. DI water

and methanol should be used (in that order) in the fi-

nal cleans. Final drying can be accomplished by plac-

ing the cleaned dice on clean filter paper and drying

with an infrared lamp for 5-10 minutes. Acids such as

hydrofluoric (HF), nitric (HNO3) and hydrochloric (HCl)

should not be used.

The effects of cleaning methods/solutions should be

verified on small samples prior to submitting the entire

lot.

Following cleaning, dice should be either used in as-

sembly (typically within a few hours) or stored in clean

containers in a reducing atmosphere or a vacuum

chamber.

3. Die Attach

a. Eutectic

AuSn preform with stage temperature of 310°C for

one minute max. AuGe preform with stage tempera-

ture of 390°C for one minute max.

b. Epoxy

For epoxy die-attach, conductive silver-filled or

goldfilled epoxies are recommended. This method

can be used for all Avago PIN chips.

4. Wire Bonding

Either ultrasonic or thermocompression bonding tech-

niques can be employed. Suggested wire is pure gold,

0.7 to 1.5 mil diameter.