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AS4C256M8D3L-12BIN Datasheet(PDF) 2 Page - Alliance Semiconductor Corporation |
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AS4C256M8D3L-12BIN Datasheet(HTML) 2 Page - Alliance Semiconductor Corporation |
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2 / 86 page  2Gb DDR3L - AS4C256M8D3L Confidential 2 Rev. 2.0 Aug. /2014 256M x 8 bit DDR3L Synchronous DRAM (SDRAM) Confidential Advanced (Rev. 2.0, Aug. /2014) Features JEDEC Standard Compliant Power supplies: VDD & VDDQ = +1.35V Backward compatible to VDD & VDDQ = 1.5V ±0.075V Operating temperature: - Commercial (Extended) (0 ~ 95°C) - Industrial (-40 ~ 95°C) Supports JEDEC clock jitter specification Fully synchronous operation Fast clock rate: 800MHz Differential Clock, CK & CK# Bidirectional differential data strobe - DQS & DQS# 8 internal banks for concurrent operation 8n-bit prefetch architecture Internal pipeline architecture Precharge & active power down Programmable Mode & Extended Mode registers Additive Latency (AL): 0, CL-1, CL-2 Programmable Burst lengths: 4, 8 Burst type: Sequential / Interleave Output Driver Impedance Control 8192 refresh cycles / 64ms - Average refresh period 7.8μs @ -40℃ ≦TC≦ +85℃ 3.9μs @ +85℃ ＜TC≦ +95℃ Write Leveling OCD Calibration Dynamic ODT (Rtt_Nom & Rtt_WR) RoHS compliant Auto Refresh and Self Refresh 78-ball 8 x 10.5 x 1.2mm FBGA package - Pb and Halogen Free Overview The 2Gb Double-Data-Rate-3 (DDR3L) DRAMs is double data rate architecture to achieve high-speed operation. It is internally configured as an eight bank DRAM. The 2Gb chip is organized as 32Mbit x 8 I/Os x 8 bank devices. These synchronous devices achieve high speed double-data-rate transfer rates of up to 1600 Mb/sec/pin for general applications. The chip is designed to comply with all key DDR3L DRAM key features and all of the control and address inputs are synchronized with a pair of externally supplied differential clocks. Inputs are latched at the cross point of differential clocks (CK rising and CK# falling). All I/Os are synchronized with differential DQS pair in a source synchronous fashion. These devices operate with a single 1.35V -0.067V/ +0.1V power supply and are available in BGA packages. Table 1. Speed Grade Information Speed Grade Clock Frequency CAS Latency tRCD (ns) tRP (ns) DDR3L-1600 800 MHz 11 13.75 13.75 Table 2. Ordering Information Product part No Org Temperature Package AS4C256M8D3L-12BCN 256M x 8 Commercial (Extended) 0°C to 95°C 78-ball FBGA AS4C256M8D3L-12BIN 256M x 8 Industrial -40°C to 95°C (Extended) 78-ball FBGA |
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