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AS4C32M16SM-7TCN Datasheet(PDF) 8 Page - Alliance Semiconductor Corporation |
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AS4C32M16SM-7TCN Datasheet(HTML) 8 Page - Alliance Semiconductor Corporation |
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8 / 73 page  AS4C32M16SM Confidential 8 | P a g e R e v 1 . 0 , J u l y 2014 Temperature and Thermal Impedance It is imperative that the SDRAM device’s temperature specifications, shown in Table 6(page 14), be maintained to ensure the junction temperature is in the proper operating range to meet data sheet specifications. An important step in maintaining the proper junction temperature is using the device’s thermal impedances correctly. The thermal impedances are listed in Table 6 (page 14) for the applicable die revision and packages being made available. These thermal impedance values vary according to the density, package, and particular design used for each device. Incorrectly using thermal impedances can produce significant errors. To ensure the compatibility of current and future de-signs, contact Alliance Memory Applications Engineering to confirm thermal impedance values. The SDRAM device’s safe junction temperature range can be maintained when the TC specification is not exceeded. In applications where the device’s ambient temperature is too high, use of forced air and/or heat sinks may be required to satisfy the case temperature specifications. Table 5: Temperature Limits Parameter Symbol Min Max Unit Notes Operating case temperature Commercial Tc 0 80 °C 1,2,3,4 Industrial -40 90 Junction temperature Commercial TJ 0 85 °C 3 Industrial -40 95 Ambient temperature Commercial Tᴀ 0 70 °C 3,5 Industrial -40 85 Peak reflow temperature TPEAK - 260 °C Notes: 1. MAX operating case temperature, TC, is measured in the center of the package on the top side of the device, as shown in Figure 6 (page 14). 2. Device functionality is not guaranteed if the device exceeds maximum TC during operation. 3. All temperature specifications must be satisfied. 4. The case temperature should be measured by gluing a thermocouple to the top-center of the component. This should be done with a 1mm bead of conductive epoxy, as de-fined by the JEDEC EIA/JESD51 standards. Take care to ensure that the thermocouple bead is touching the case. 5. Operating ambient temperature surrounding the package. |
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