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HSMP-3813 Datasheet(PDF) 7 Page - Broadcom Corporation.

Part # HSMP-3813
Description  Surface Mount RF PIN Low Distortion Attenuator Diodes
Download  9 Pages
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Manufacturer  BOARDCOM [Broadcom Corporation.]
Direct Link  http://www.broadcom.com
Logo BOARDCOM - Broadcom Corporation.

HSMP-3813 Datasheet(HTML) 7 Page - Broadcom Corporation.

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Package Dimensions
Outline 23 (SOT-23)
Package Characteristics
Lead Material .................................................... Copper (SOT-323); Alloy 42 (SOT-23)
Lead Finish ......................................................................... Tin 100% (Lead-free option)
Maximum Soldering Temperature ............................................ 260°C for 5 seconds
Minimum Lead Strength........................................................................... 2 pounds pull
Typical Package Inductance ...................................................................................... 2 nH
Typical Package Capacitance .............................................. 0.08 pF (opposite leads)
Outline SOT-323 (SC-70)
Option Descriptions
-BLKG = Bulk, 100 pcs. per antistatic bag
-TR1G = Tape and Reel, 3000 devices per 7" reel
-TR2G = Tape and Reel, 10,000 devices per 13" reel
Tape and Reeling conforms to Electronic Industries RS-481, “Taping of Surface
Mounted Components for Automated Placement.”
Ordering Information
Specify part number followed by option. For example:
HSMP
-
381x -
XXX
Bulk or Tape and Reel Option
Part Number; x = Lead Code
Surface Mount PIN
e
B
e2
e1
E1
C
E
XXX
L
D
A
A1
Notes:
XXX-package marking
Drawings are not to scale
DIMENSIONS (mm)
MIN.
0.79
0.000
0.30
0.08
2.73
1.15
0.89
1.78
0.45
2.10
0.45
MAX.
1.20
0.100
0.54
0.20
3.13
1.50
1.02
2.04
0.60
2.70
0.69
SYMBOL
A
A1
B
C
D
E1
e
e1
e2
E
L
e
B
e1
E1
C
E
XXX
L
D
A
A1
Notes:
XXX-package marking
Drawings are not to scale
DIMENSIONS (mm)
MIN.
0.80
0.00
0.15
0.08
1.80
1.10
1.80
0.26
MAX.
1.00
0.10
0.40
0.25
2.25
1.40
2.40
0.46
SYMBOL
A
A1
B
C
D
E1
e
e1
E
L
1.30 typical
0.65 typical


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