2

Integrated Silicon Solution, Inc. — 1-800-379-4774

Rev. H

10/02/00

IS63LV1024

PIN CONFIGURATION

32-Pin SOJ

1

2

3

4

5

6

7

8

9

10

11

12

13

14

15

16

32

31

30

29

28

27

26

25

24

23

22

21

20

19

18

17

A0

A1

A2

A3

CE

I/O0

I/O1

Vcc

GND

I/O2

I/O3

WE

A4

A5

A6

A7

A16

A15

A14

A13

OE

I/O7

I/O6

GND

Vcc

I/O5

I/O4

A12

A11

A10

A9

A8

PIN DESCRIPTIONS

A0-A16

Address Inputs

CE

Chip Enable Input

OE

Output Enable Input

WE

Write Enable Input

I/O0-I/O7

Bidirectional Ports

Vcc

Power

GND

Ground

Symbol

Parameter

Value

Unit

Terminal Voltage with Respect to GND

–0.5 to Vcc + 0.5

V

Temperature Under Bias

–55 to +125

°C

Storage Temperature

–65 to +150

°C

Power Dissipation

1.0

W

Notes:

1. Stress greater than those listed under ABSOLUTE MAXIMUM RATINGS may cause

permanent damage to the device. This is a stress rating only and functional operation of the

device at these or any other conditions above those indicated in the operational sections of

this specification is not implied. Exposure to absolute maximum rating conditions for extended

periods may affect reliability.

TRUTH TABLE

Mode

WE

CE

OE

I/O Operation Vcc Current

Not Selected

X

H

X

High-Z

(Power-down)

Output Disabled H

L

H

High-Z

Read

H

L

L

Write

L

L

X

1

2

3

4

5

6

7

8

9

10

11

12

13

14

15

16

32

31

30

29

28

27

26

25

24

23

22

21

20

19

18

17

A0

A1

A2

A3

CE

I/O0

I/O1

Vcc

GND

I/O2

I/O3

WE

A4

A5

A6

A7

A16

A15

A14

A13

OE

I/o7

I/O6

GND

Vcc

I/O5

I/O4

A12

A11

A10

A9

A8

PIN CONFIGURATION

32-Pin TSOP (Type II) (T)