LMT86LPM datasheet(6/30 Pages) TI1

Part #	LMT86LPM

Description	SC70/TO-92, Analog Temperature Sensors with Class-AB Output

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Manufacturer	TI1 [Texas Instruments]

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LMT86, LMT86-Q1

SNIS169C – MARCH 2013 – REVISED OCTOBER 2015

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7.5 Thermal Information

(1)

LMT86

LMT86-Q1

THERMAL METRIC(2)

UNIT

DCK

LP

5 PINS

3 PINS

RθJA

Junction-to-ambient thermal resistance(3)(4)

275

167

RθJC(top)

Junction-to-case (top) thermal resistance

84

80

RθJB

Junction-to-board thermal resistance

56

146

°C/W

ψJT

Junction-to-top characterization parameter

1.2

35

ψJB

Junction-to-board characterization parameter

55

146

(1)

For information on self-heating and thermal response time see section Mounting and Thermal Conductivity.

(2)

For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

(3)

The junction to ambient thermal resistance (RθJA) under natural convection is obtained in a simulation on a JEDEC-standard, High K

board as specified in JESD51-7, in an environment described in JESD51-2. Exposed pad packages assume that thermal vias are

included in the PCB, per JESD 51-5.

(4)

Changes in output due to self heating can be computed by multiplying the internal dissipation by the thermal resistance.

6

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