Power-Supply Bypass Capacitor (C3)

The power-supply bypass capacitor (C3) lowers the

output impedance of the power supply and reduces the

impact of the MAX9721’s charge-pump switching tran-

Layout and Grounding

Proper layout and grounding are essential for optimum

performance. Connect PGND and SGND together at a

with C3. Place capacitors C2 and C3 as close to the

MAX9721 as possible. Route PGND, and all traces that

carry switching transients, away from SGND and the

audio signal path.

The MAX9721 does not require additional heatsinking.

The thin QFN package features an exposed paddle that

improves thermal efficiency of the package.

Ensure

that the exposed paddle is electrically isolated from

necessary.

UCSP Applications Information

For the latest application details on UCSP construction,

dimensions, tape carrier information, printed circuit

board techniques, bump-pad layout , and recommend-

ed reflow temperature profile, as well as the latest infor-

mation on reliability testing results, go to Maxim’s

website at www.maxim-ic.com/ucsp for the Application

Note: UCSP—A Wafer-Level Chip-Scale Package.

Chip Information

TRANSISTOR COUNT: 2559

PROCESS: BiCMOS

1V, Fixed-Gain, DirectDrive, Stereo Headphone

Amplifier with Shutdown

10

______________________________________________________________________________________

Table 1. Suggested Capacitor Manufacturers

SUPPLIER

PHONE

FAX

WEBSITE

Taiyo Yuden

800-348-2496

847-925-0899

www.t-yuden.com

TDK

847-803-6100

847-390-4405

www.component.tdk.com