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MAX9721AETC Datasheet(PDF) 10 Page - Maxim Integrated Products |
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MAX9721AETC Datasheet(HTML) 10 Page - Maxim Integrated Products |
10 / 14 page Power-Supply Bypass Capacitor (C3) The power-supply bypass capacitor (C3) lowers the output impedance of the power supply and reduces the impact of the MAX9721’s charge-pump switching tran- sients. Bypass VDD to PGND with the same value as C1. Place C3 as close to VDD as possible. Layout and Grounding Proper layout and grounding are essential for optimum performance. Connect PGND and SGND together at a single point on the PC board. Connect PVSS to SVSS and bypass with C2 to PGND. Bypass VDD to PGND with C3. Place capacitors C2 and C3 as close to the MAX9721 as possible. Route PGND, and all traces that carry switching transients, away from SGND and the audio signal path. The MAX9721 does not require additional heatsinking. The thin QFN package features an exposed paddle that improves thermal efficiency of the package. Ensure that the exposed paddle is electrically isolated from GND and VDD. Connect the exposed paddle to VSS if necessary. UCSP Applications Information For the latest application details on UCSP construction, dimensions, tape carrier information, printed circuit board techniques, bump-pad layout , and recommend- ed reflow temperature profile, as well as the latest infor- mation on reliability testing results, go to Maxim’s website at www.maxim-ic.com/ucsp for the Application Note: UCSP—A Wafer-Level Chip-Scale Package. Chip Information TRANSISTOR COUNT: 2559 PROCESS: BiCMOS 1V, Fixed-Gain, DirectDrive, Stereo Headphone Amplifier with Shutdown 10 ______________________________________________________________________________________ Table 1. Suggested Capacitor Manufacturers SUPPLIER PHONE FAX WEBSITE Taiyo Yuden 800-348-2496 847-925-0899 www.t-yuden.com TDK 847-803-6100 847-390-4405 www.component.tdk.com |
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