MPXC2011DT1 MPXC2012DT1

1

Sensor Device Data

Freescale Semiconductor

High Volume Sensor for

Low Pressure Applications

Freescale Semiconductor has developed a low cost, high volume, miniature pressure

sensor package which is ideal as a sub--module component or a disposable unit. The

unique concept of the Chip Pak allows great flexibility in system design while allowing an

economic solution for the designer. This new chip carrier package uses Freescale

Semiconductor’s unique sensor die with its piezoresistive technology, along with the

added feature of on--chip, thin--film temperature compensation and calibration.

NOTE: Freescale Semiconductor is also offering the Chip Pak package in

application--specific configurations, which will have an “SPX” prefix, followed by a

four--digit number, unique to the specific customer.

Features:

• Low Cost

• Integrated Temperature Compensation and Calibration

• Ratiometric to Supply Voltage

• Polysulfone Case Material (Medical, Class V Approved)

• Provided in Easy--to--Use Tape and Reel

Application Examples

• Respiratory Diagnostics

• Air Movement Control

• Controllers

• Pressure Switching

NOTE: The die and wire bonds are exposed on the front side of the Chip Pak

(pressure is applied to the backside of the device). Front side die and wire protection

must be provided in the customer’s housing. Use caution when handling the devices

during all processes.

Freescale

Semiconductor ’s

MPXC2011DT1/

MPXC2012DT1 Pressure Sensor has been designed for

medical usage by combining the performance of Freescale

Semiconductor’s shear stress pressure sensor design and

the use of biomedically approved materials. Materials with a

proven history in medical situations have been chosen to

provide a sensor that can be used with confidence in

applications, such as invasive blood pressure monitoring. It

can be sterilized using ethylene oxide. The portions of the

pressure sensor that are required to be biomedically

approved are the rigid housing and the gel coating.

The rigid housing is molded from a white, medical grade

polysulfone that has passed extensive biological testing

including: tissue culture test, rabbit implant, hemolysis,

intracutaneous test in rabbits, and system toxicity, USP.

The MPXC2011DT1 contains a silicone dielectric gel

which covers the silicon piezoresistive sensing element. The

gel is a nontoxic, nonallergenic elastomer system which

meets all USP XX Biological Testing Class V requirements.

The properties of the gel allow it to transmit pressure uni-

formly to the diaphragm surface, while isolating the internal

electrical connections from the corrosive effects of fluids,

such as saline solution. The gel provides electrical isolation

sufficient to withstand defibrillation testing, as specified in the

proposed Association for the Advancement of Medical

Instrumentation (AAMI) Standard for blood pressure trans-

ducers. A biomedically approved opaque filler in the gel pre-

vents bright operating room lights from affecting the

performance of the sensor.

The MPXC2012DT1 is a no--gel option.

Preferred devices are Freescale Semiconductor recommended choices for future use and best overall value.

MPXC2011DT1

Rev. 3, 10/2004

Freescale Semiconductor

Technical Data

© Freescale Semiconductor, Inc., 2004. All rights reserved.

MPXC2011DT1

MPXC2012DT1

PRESSURE SENSORS

0to75mmHg(0to10kPa)

PIN NUMBER

MPXC2011DT1/MPXC2012DT1

CASE 423A

1

2

Gnd

S+

3

4

S--

CHIP PAK PACKAGE

Freescale Semiconductor Preferred Device